IP Library Granted Patent US 8,492,785
Granted Patent B2
US 8,492,785 · App. 13/368,629 · Granted Jul 23, 2013

Semiconductor light-emitting element and semiconductor light-emitting device

Inventor: Takashi Hodota (Ichihara, JP)
Assignee: Toyoda Gosei Co., Ltd.
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Quick Facts
Patent No.
US 8,492,785
App. No.
13/368,629
Granted
Jul 23, 2013
Kind
B2
Abstract

In a FC-mounted semiconductor light-emitting element, rise of a forward voltage is suppressed and light emission output is increased. A semiconductor light-emitting element includes: a laminated semiconductor layer including a first semiconductor layer having a first conduction type, a light-emitting layer and a second semiconductor layer having a second conduction type opposite to the first conduction type; a first electrode connected to the first semiconductor layer; and a second electrode provided on the second semiconductor layer, the second electrode including: a transparent conductive layer having thick portions and transparent to light from the light-emitting layer; an insulation layer laminated on the transparent conductive layer with a lower refractive index than the transparent conductive layer; a conductive metal reflecting layer laminated on the insulation layer; and a conductor portion provided through the insulation layer, which is electrically connected to one of the thick portions and the metal reflecting layer.

Claims (16)

1. A semiconductor light-emitting element comprising:

a laminated semiconductor layer in which a first semiconductor layer having a first conduction type, a light-emitting layer and a second semiconductor layer having a second conduction type that is opposite to the first conduction type are laminated;

a first electrode that is connected to the first semiconductor layer; and

a second electrode that is provided on a surface of the second semiconductor layer,

the second electrode including:

a transparent conductive layer that includes a plurality of thick portions thicker than other portions and has transparency to light emitted from the light-emitting layer;

an insulation layer that is laminated on the transparent conductive layer and has a refractive index lower than a refractive index of the transparent conductive layer;

a metal reflecting layer that is laminated on the insulation layer and has conductivity; and

a conductor portion that is provided through the insulation layer, one end of which is electrically connected to one of the thick portions of the transparent conductive layer and the other end of which is electrically connected to the metal reflecting layer.

2. The semiconductor light-emitting element according to claim 1 , wherein the thick portions have convex portions on a side of the insulation layer.

3. The semiconductor light-emitting element according to claim 1 , wherein the thick portions include any one of an isolation pattern and a lattice pattern in a planar view.

4. The semiconductor light-emitting element according to claim 1 , wherein the insulation layer is composed of silicon dioxide.

5. The semiconductor light-emitting element according to claim 1 , wherein the transparent conductive layer is composed of conductive oxide containing indium (In).

6. The semiconductor light-emitting element according to claim 1 , wherein the laminated semiconductor layer is composed of a group III nitride semiconductor.

7. The semiconductor light-emitting element according to claim 1 , wherein, in the laminated semiconductor layer, the first conduction type of the first semiconductor layer is an n-type in which a carrier is an electron and the second conduction type of the second semiconductor layer is a p-type in which a carrier is a hole.

8. The semiconductor light-emitting element according to claim 1 , further comprising a first connector used for electrically connecting the first electrode to an outside and a second connector used for electrically connecting the second electrode to the outside.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2012
From: SHOWA DENKO K.K.
To: TOYODA GOSEI CO., LTD.
Reel/Frame 029401/0974 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2012
From: HODOTA, TAKASHI
To: SHOWA DENKO K.K.
Reel/Frame 027671/0730 →
Priority Claims (1)
JP 2011-026577 · Feb 9, 2011 · national
Continuity (1)
Related Publication 20120199860A1 · Aug 9, 2012