Thermosetting resin composition and cured product of the same
An object of the present invention is to provide a thermosetting resin composition having high heat resistance, high flame retardancy, good mechanical properties, and high dimensional stability. To achieve the object, there are provided a thermosetting resin composition containing a polyimide resin and a boron compound represented by general formula below and a cured product of the thermosetting resin composition. (R 1 's each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms. R 2 's each independently represent hydrogen, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms. Y represents a nitrogen-containing heterocyclic compound. R 3 's each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms. Z represents a nitrogen-containing heterocyclic compound.)
1. A thermosetting resin composition comprising a polyimide resin (A) and at least one boron compound (B) selected from compounds represented by general formulae (b1) and (b2) below,
in the formula, R 1 's each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms:
in the formula, R 2 's each independently represent hydrogen, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; and Y represents a nitrogen-containing heterocyclic compound;
wherein at least one polyimide resin (A) selected from structural units represented by general formula (a1), (a2) and combination thereof
2. The thermosetting resin composition according to claim 1 , wherein the boron compound (B) is a boron compound represented by the general formula (b2).
3. The thermosetting resin composition according to claim 1 , wherein Y of the boron compound represented by the general formula (b2) is pyridine.
4. The thermosetting resin composition according to claim 1 , wherein the content of the boron compound (B) is 0.5 to 30 parts by mass relative to 100 parts by mass of the polyimide resin (A).
5. The thermosetting resin composition according to claim 1 , wherein the polyimide resin (A) is a polyimide resin having one or more structures represented by general formulae below
* in the structures represented by the general formulae (a1-3) to (a1-8) represents a bonding point; R 4 's each independently represent a hydrogen atom or a hydrocarbon group having 1 to 9 carbon atoms; and a1, a2, a3, a4, a5, and a6 each represent the number of repetitions of a structural unit in parentheses and are each 1 to 1000.
6. The thermosetting resin composition according to claim 1 , wherein the polyimide resin having the imide five-membered ring structure directly connected to the cycloaliphatic hydrocarbon structure is a polyimide resin having one or more structures represented by general formulae below
*in the structures represented by the general formulae (a2-3) to (a2-8) represents a bonding point; R 4 's each independently represent a hydrogen atom or a hydrocarbon group having 1 to 9 carbon atoms; and a7, a8, a9, a10, a11, and a12 each represent the number of repetitions of a structural unit in parentheses and are each 1 to 1000.
7. The thermosetting resin composition according to claim 5 or 6 , wherein R 4 's in the structures represented by the general formulae (a1-7), (a1-8), (a2-7), and (a2-8) represent a methyl group.
8. The thermosetting resin composition according to claim 1 , wherein the polyimide resin having a divalent structural unit represented by the general formula (a2) is a polyimide resin having the structure represented by the general formula (a2) in a molality of 0.02 to 2.0 mmol/g based on the solid content by mass of the polyimide resin.
9. The thermosetting resin composition according to claim 1 , wherein the polyimide resin (A) is a polyimide resin having structures represented by general formula (a1-7) or (a1-8) below and general formula (a2-7) or (a2-8) below
*in the structures represented by the general formulae (a1-7), (a1-8), (a2-7), and (a2-8) represents a bonding point; R 4 's each independently represent a hydrogen atom or a hydrocarbon group having 1 to 9 carbon atoms; and a5, a6, a11, and a12 each represent the number of repetitions of a structural unit in parentheses and are each 1 to 1000.
10. The thermosetting resin composition according to claim 1 , wherein a terminal group of the polyimide resin (A) is carboxylic acid and/or carboxylic acid anhydride, and an acid value is 1 to 50 on a solid content basis.
11. The thermosetting resin composition according to claim 1 , wherein the polyimide resin is a polyimide resin that is soluble in gamma-butyrolactone when the polyimide resin is dissolved in gamma-butyrolactone at 25° C. so as to have a concentration of 10% by mass.
12. A cured product obtained by curing the thermosetting resin composition according to claim 1 .
13. A thermosetting resin composition comprising a polyimide resin (A) and a boron compound (B) represented by general formula (b3) below, wherein the one polyimide resin (A) selected from structural unit represented by general formula (a1), (a2) and combination thereof
in the formula, R 3 's each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; and Z represents a nitrogen-containing heterocyclic compound
14. The thermosetting resin composition according to claim 13 , wherein Z+ of the boron compound represented by the general formula (b3) is an imidazolium salt.
15. The thermosetting resin composition according to claim 13 , wherein the content of the boron compound (B) is 0.5 to 30 parts by mass relative to 100 parts by mass of the polyimide resin.
16. The thermosetting resin composition according to claim 13 , wherein the polyimide resin (A) is a polyimide resin having one or more structures represented by general formulae below
*in the structures represented by the general formulae (a1-3) to (a1-8) represents a bonding point; R 4 's each independently represent a hydrogen atom or a hydrocarbon group having 1 to 9 carbon atoms; and a1, a2, a3, a4, a5, and a6 each represent the number of repetitions of a structural unit in parentheses and are each 1 to 1000.
17. The thermosetting resin composition according to claim 16 , wherein R 4 's in the structures represented by the general formulae (a1-7), (a1-8), (a2-7), and (a2-8) represent a methyl group.
18. The thermosetting resin composition according to claim 13 , wherein the polyimide resin having the imide five-membered ring structure directly connected to the cycloaliphatic hydrocarbon structure is a polyimide resin having one or more structures represented by general formulae below
*in the structures represented by the general formulae (a2-3) to (a2-8) represents a bonding point; R 4 's each independently represent a hydrogen atom or a hydrocarbon group having 1 to 9 carbon atoms; and a7, a8, a9, a10, a11, and a12 each represent the number of repetitions of a structural unit in parentheses and are each 1 to 1000.
19. The thermosetting resin composition according to claim 13 , wherein the polyimide resin having a divalent structural unit represented by the general formula (a2) is a polyimide resin having the structure represented by the general formula (a2) in a molality of 0.02 to 2.0 mmol/g based on the solid content by mass of the polyimide resin.
20. The thermosetting resin composition according to claim 13 , wherein the polyimide resin (A) is a polyimide resin having structures represented by general formula (a1-7) or (a1-8) below and general formula (a2-7) or (a2-8) below,
*in the structures represented by the general formulae (a1-7), (a1-8), (a2-7), and (a2-8) represents a bonding point; R 4 's each independently represent a hydrogen atom or a hydrocarbon group having 1 to 9 carbon atoms; and a5, a6, a11, and a12 each represent the number of repetitions of a structural unit in parentheses and are each 1 to 1000.
21. A cured product obtained by curing the thermosetting resin composition according to claim 20 .
22. The thermosetting resin composition according to claim 13 , wherein a terminal group of the polyimide resin (A) is carboxylic acid and/or carboxylic acid anhydride, and an acid value is 1 to 50 on a solid content basis.
23. The thermosetting resin composition according to claim 22 , wherein the polyimide resin is a polyimide resin that is soluble in gamma-butyrolactone when the polyimide resin is dissolved in gamma-butyrolactone at 25° C. so as to have a concentration of 10% by mass.