Electronic device

1. An electronic device,

comprising: a metal-insulating layer substrate comprising an insulating layer and a first metallization on a surface side of the insulating layer, the first metallization is structured for forming a plurality of metallization areas, and comprising at least one electric component generating heat loss and provided on a first metallization area of the first metallization,

wherein the first metallization has a first layer thickness (D) on a sub-area with which the electric component is at least thermally connected, the first layer thickness (D) is substantially greater than a second layer thickness (d) of the first metallization area outside of the first sub-area, wherein a difference (b) between the first layer thickness (D) and the second layer thickness (d) is at least equal to or greater than half the second layer thickness (d) of the first metallization area outside of the first sub-area and that a distance (a1) of the component from a margin of the first sub-area is equal to or greater than the difference (b) between the first layer thickness (D) and the second layer thickness (d).

2. The electronic device according to claim 1 , wherein the first metallization area has a layer thickness that changes stepwise, the first sub-area with the first layer thickness (D) is enclosed at least partially by a sub-area with the second layer thickness (d).

3. The electronic device according to claim 1 , wherein the first metallization comprises a second structured metallization area, the second structured metallization area has a layer thickness smaller than the first layer thickness (D) of the first sub-area and equal to the second layer thickness (d) of the first metallization area outside of the first sub-area.

4. The electronic device according to claim 1 , wherein a second metallization is provided on a second surface side of the insulating layer facing away from the first metallization.

5. The electronic device according to claim 4 , wherein the first or second metallization comprises copper, a copper alloy, aluminum or an aluminum alloy.

6. The electronic device according to claim 1 , wherein the layer thickness of the first metallization outside of the first sub-area or a layer thickness of the second metallization is between 0.5 mm and 0.8 mm.

7. The electronic device according to claim 1 , wherein a thickness of the insulating layer is between 0.15 mm and 1.0 mm.

8. The electronic device according to claim 1 , wherein the insulating layer is a ceramic layer selected from Al 2 O 3 , AIN, Si 3 N 4 , SiC or Al 2 O 3 +ZrO 2 .

9. The electronic device according to claim 1 , wherein a surface area occupied by the component has a square measure of 5 mm 2 -180 mm 2 .

10. The electronic device according to claim 1 , wherein the component generating heat loss is connected by a solder, sintered or adhesive bond with the first metallization area of the first metallization.

11. The electronic device according to claim 1 , wherein the insulating layer is connected by a second metallization with a cooler by DCB bonding, soldering or active soldering.

12. The electronic device according to claim 1 , wherein the metallization areas of the first metallization are produced by step etching.

13. The electronic device according to claim 1 , wherein the layer thickness (D) of the first sub-area is achieved by applying an additional metal layer to a metal layer connected with the insulating layer by chemical or galvanic precipitation, by laser sintering or by applying a metal platelet.

14. The electronic device according to claim 1 , wherein a second metallization area is structured for forming conductor strips or contact surfaces.

15. The electronic device according to claim 14 , wherein a component with reduced heat loss is provided on the second structured metallization area.