Patent Assignment
Reel/Frame 033347/0420
Change of Name
Recorded: 2014-07-17
Pages: 6
Assignor
CURAMIK ELECTRONICS GMBH
Executed: 2014-05-07
Assignee
ROGERS GERMANY GMBH
AM STADTWALD 2, ESCHENBACH, 92676, GERMANY
Covered Properties
(49)
Multiple Substrate and Process for Its Production
Patent:
5,676,855 →
Application:
08/547,815 →
Multiple Substrate
Patent:
5,721,044 →
Application:
08/599,234 →
Process for Producing a Metal-Ceramic Substrate
Patent:
6,182,358 →
Application:
08/665,967 →
Process for Producing a Ceramic Substrate and a Ceramic Substrate
Patent:
6,066,219 →
Application:
08/794,516 →
Metal Ceramic Substrate
Patent:
5,981,036 →
Application:
08/835,049 →
Cooler or Heat Sink for Electrical Components or Circuits and an Electrical Circuit with This Heat Sink
Patent:
6,014,312 →
Application:
09/038,016 →
Process for the Manufacturing of an Arched Metal Ceramic Substratum
Patent:
6,345,437 →
Application:
09/055,881 →
Heat Exchanger Arrangement and Cooling System with at Least One Such Heat Exchanger Arrangement
Patent:
5,987,893 →
Application:
09/123,286 →
Process for Producing a Ceramic-Metal Substrate
Patent:
6,093,443 →
Application:
09/190,619 →
Process for Producing a Metal-Ceramic Substrate
Patent:
6,297,469 →
Application:
09/330,999 →
Process for producing a metal-ceramic substrate and a metal-ceramic substrate
Patent:
6,207,221 →
Application:
09/498,647 →
Ceramic/Metal Substrate, Especially Composite Substrate
Patent:
6,638,592 →
Application:
09/589,149 →
Process of Making a Metal Matrix Composite (Mmc) Component
Patent:
6,502,623 →
Application:
09/651,989 →
Mirror for Laser Applications and Method for Manufacture of Said Mirror
Process for the Manufacture of Metal-Ceramic Compound Material in Particular Metal-Ceramic Substrates and Metal-Ceramic Compound Material Especially Metal-Ceramic Substrate Manufactured According to This Process
Method for the Production of a Metal-Ceramic Substrate, Preferably a Copper Ceramic Substrate
Cooling Devices for Cooling Electric Components, Module Including Cooling Device and Electric Components, and Assembly of Cooling Device or Module and Support
Method for manufacturing a ceramic/metal substrate
Application:
10/560,525 →
Publication:
US 2006/0183298
Device with a Heat Source Formed by a Function Element That Is to Be Cooled, at Least One Heat Sink, and Least One Intermediate Layer Located Between the Heat Source and the Heat Sink
Method for Manufacturing Plate Stacks, Particularly Coolers or Cooler Elements Consisting of Plate Stacks
Conductor Board and Method for Producing a Conductor Board
Method for Manufacturing Plate Stacks, Particularly Coolers or Cooler Elements Made Up of Plate Stacks
Conductor Board and Method for Producing a Conductor Board
Method for the production of a metal-ceramic substrate
Metal-Ceramic Substrate
Method for the Production of a Metal-Ceramic Substrate or Copper-Ceramic Substrate, and Support to Be Used in Said Method
Metal-Ceramic Substrate
Method for Treating Nanofiber Material and Composition of Nanofiber Material
Electrical Module
Diode Laser Array and Method for Manufacturing Such an Array
Heat Sink in the Form of a Heat Pipe and Process for Manufacturing Such a Heat Sink
Method for Manufacturing a Metal-Ceramic Substrate
Composite Material, Especially Multilayer Material, and Adhesive or Bonding Material
Heat Transport Medium and Heating or Cooling System with the Medium
Application:
12/087,335 →
Publication:
US 2009/0008062
Process for Producing Peltier Modules, and Peltier Module
Heat Sink and Assembly or Module Unit
Method for Producing a Metal-Ceramic Substrate for Electric Circuits on Modules
Composite Material, Method for Producing a Composite Material and Adhesive or Binding Material
Application:
13/126,559 →
Publication:
US 2011/0274888
Metal-Ceramic Substrate
Application:
13/258,852 →
Publication:
US 2012/0045657
Printed Circuit Board Made from a Composite Material
Metal-ceramic substrate and method for manufacturing such a substrate
Cooled Electric Unit
Application:
13/322,765 →
Publication:
US 2012/0069524
Electronic Device
Method for the Production of a Metal-Ceramic Substrate, Preferably a Copper Ceramic Substrate
Package for Metal-Ceramic Substrate and Method for Packing Such Substrates
Packaging for Substrates and Packaging Unit Having Such Packaging
Metal-Ceramic Substrate
Thermoelectric Generator Module, Metal-Ceramic Substrate and Method of Producing Such a Metal-Ceramic Substrate
Application:
14/368,372 →
Publication:
US 2014/0345664
Process for Producing Dcb Substrates
Application:
14/368,968 →
Publication:
US 2014/0338162
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 25, 2004
From: SCHULZ-HARDER, JURGEN; MEYER, ANDREAS
To: CURAMIK ELECTRONCS GMBH
Reel/Frame 014668/0188 →
Assignment of Assignor's Interest
Oct 25, 2004
From: KUGLER GMBH
To: CURAMIK ELECTRONICS GMBH
Reel/Frame 015284/0389 →
Assignment of Assignor's Interest
May 20, 2005
From: EXEL, KARL; KRIEGEL, KAI; LEFRANC, GUY; SCHULZ-HARDER, JURGEN
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 016692/0746 →
Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 014668 Frame 0188. Assignor(S) Hereby Confirms the Fact That the Correct Name of the Assignee Should Be Changed from Curamik Electroncs Gmbh to Curamik Electronics Gmbh.
Nov 18, 2005
From: SCHULZ-HARDER, JURGEN; MEYER, ANDREAS
To: CURAMIK ELECTRONICS GMBH
Reel/Frame 016798/0426 →
Assignment of Assignor's Interest
Dec 20, 2005
From: SCHULZ-HARDER, JURGEN
To: ELECTROVA AG
Reel/Frame 017125/0926 →
Assignment of Assignor's Interest
Dec 20, 2005
From: CURAMIK ELECTRONICS GMBH
To: ELECTROVAC AG
Reel/Frame 017125/0524 →
Assignment of Assignor's Interest
Dec 20, 2005
From: SCHULZ-HARDER, JURGEN; MAIER, PETER H.
To: ELECTROVAC AG
Reel/Frame 017125/0527 →
Assignment of Assignor's Interest
Jan 19, 2006
From: SCHULZ-HARDER, JURGEN; HAMMEL, ERNST
To: CURAMIK ELECTRONICS GMBH; ELECTROVAC AG
Reel/Frame 017203/0871 →
Assignment of Assignor's Interest
Mar 14, 2006
From: SCHULZ-HARDER, JURGEN; MITTEREGGER, KURT; EXEL, KARL; WEISSER, JURGEN
To: CURAMIK ELECTRONICS GMBH
Reel/Frame 017335/0893 →
Assignment of Assignor's Interest
Sep 1, 2006
From: SCHULZ-HARDER, JURGEN
To: ELECTROVAC AG
Reel/Frame 018226/0845 →
Assignment of Assignor's Interest
Jan 23, 2007
From: EXEL, KARL; KRIEGEL, KAI; LEFRANC, GUY; SCHULZ-HARDER, JURGEN
To: SIEMENS AKTIENGESELLSCHAFT; CURAMIK ELECTRONICS GMBH
Reel/Frame 018836/0118 →
Assignment of Assignor's Interest
Jun 14, 2007
From: ELECTROVA AG
To: CURAMIK ELECTRONICS GMBH
Reel/Frame 019432/0037 →
Assignment of Assignor's Interest
Mar 24, 2011
From: CURAMIK HOLDING GMBH IN LIQUIDATION
To: CURAMIK ELECTRONICS GMBH
Reel/Frame 026015/0375 →
Change of Name
Mar 24, 2011
From: ELECTROVAC AG
To: CURAMIK HOLDING GMBH, IN LIQUIDATION
Reel/Frame 026015/0157 →
Change of Name
Jan 27, 2012
From: ELECTROVAC, FABRIKATION ELEKTROTECHNISCHER SPEZIALARTIKEL GESELLSCHAFT M.B.H.
To: EC VERWERTUNGSGESELLSCHAFT 1 GMBH IN LIQU.
Reel/Frame 027609/0551 →
Assignment of Assignor's Interest
Feb 23, 2012
From: EC VERWERTUNGSGESELLSCHAFT 1 GMBH IN LIQU.
To: CURAMIK ELECTRONICS GMBH
Reel/Frame 027751/0505 →
Assignment of Assignor's Interest
Mar 16, 2012
From: EC VERWERTUNGSGESELLSCHAFT 1 GMBH IN LIQU.
To: CURAMIK ELECTRONICS GMBH
Reel/Frame 027879/0682 →