Patent Assignment
Reel/Frame 026015/0375
Assignment of Assignor's Interest
Recorded: 2011-03-24
Pages: 6
Assignor
CURAMIK HOLDING GMBH IN LIQUIDATION
Executed: 2011-01-31
Assignee
CURAMIK ELECTRONICS GMBH
AM STADTWALD 2, ESCHENBACH, 92676, GERMANY
Covered Properties
(21)
Process for Producing a Metal-Ceramic Substrate
Patent:
5,465,898 →
Application:
08/250,904 →
Metal Coated Substrate Having Improved Resistivity to Cyclic Temperature Stress
Patent:
5,527,620 →
Application:
08/253,247 →
Multiple Substrate and Process for Its Production
Patent:
5,508,089 →
Application:
08/253,855 →
Multiple Substrate and Process for Its Production
Patent:
5,676,855 →
Application:
08/547,815 →
Process for Producing a Metal-Ceramic Substrate
Patent:
6,182,358 →
Application:
08/665,967 →
Metal Ceramic Substrate
Patent:
5,981,036 →
Application:
08/835,049 →
Cooling System
Patent:
6,345,665 →
Application:
09/248,323 →
Cooler for Electrical Components
Patent:
7,051,793 →
Application:
09/294,388 →
Process for Producing a Metal-Ceramic Substrate
Patent:
6,297,469 →
Application:
09/330,999 →
Process for producing a metal-ceramic substrate and a metal-ceramic substrate
Patent:
6,207,221 →
Application:
09/498,647 →
Ceramic/Metal Substrate, Especially Composite Substrate
Patent:
6,638,592 →
Application:
09/589,149 →
Process for the Manufacture of Metal-Ceramic Compound Material in Particular Metal-Ceramic Substrates and Metal-Ceramic Compound Material Especially Metal-Ceramic Substrate Manufactured According to This Process
Device with a Heat Source Formed by a Function Element That Is to Be Cooled, at Least One Heat Sink, and Least One Intermediate Layer Located Between the Heat Source and the Heat Sink
Method for Manufacturing Plate Stacks, Particularly Coolers or Cooler Elements Consisting of Plate Stacks
Method for Manufacturing Plate Stacks, Particularly Coolers or Cooler Elements Made Up of Plate Stacks
Method for the production of a metal-ceramic substrate
Substrate
Application:
11/791,657 →
Publication:
US 2008/0118706
Method for Treating Nanofiber Material and Composition of Nanofiber Material
Composite Material, Especially Multilayer Material, and Adhesive or Bonding Material
Heat Transport Medium and Heating or Cooling System with the Medium
Application:
12/087,335 →
Publication:
US 2009/0008062
Heat Sink and Assembly or Module Unit
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 20, 2005
From: SCHULZ-HARDER, JURGEN; MAIER, PETER H.
To: ELECTROVAC AG
Reel/Frame 017125/0527 →
Assignment of Assignor's Interest
Dec 20, 2005
From: SCHULZ-HARDER, JURGEN
To: ELECTROVA AG
Reel/Frame 017125/0926 →
Assignment of Assignor's Interest
Jan 19, 2006
From: SCHULZ-HARDER, JURGEN; HAMMEL, ERNST
To: CURAMIK ELECTRONICS GMBH; ELECTROVAC AG
Reel/Frame 017203/0871 →
Assignment of Assignor's Interest
Sep 1, 2006
From: SCHULZ-HARDER, JURGEN
To: ELECTROVAC AG
Reel/Frame 018226/0845 →
Assignment of Assignor's Interest
Jun 14, 2007
From: SCHULZ-HARDER, JURGEN
To: ELECTROVAC AG
Reel/Frame 019429/0347 →
Assignment of Assignor's Interest
Oct 29, 2008
From: HAMMEL, ERNST; TANG, XINHE
To: ELECTROVAC AG
Reel/Frame 021760/0232 →
Assignment of Assignor's Interest
Jan 7, 2009
From: TSE, KA CHUN; TANG, BEN ZHONG; HAMMEL, ERNST; TANG, XINHE
To: ELECTROVAC AG
Reel/Frame 022067/0963 →
Assignment of Assignor's Interest
Apr 6, 2009
From: SCHULZ-HARDER, JURGEN
To: ELECTROVAC AG
Reel/Frame 022506/0652 →
Assignment of Assignor's Interest
Feb 3, 2010
From: HAMMEL, ERNST; SCHULZ-HARDER, JURGEN
To: ELECTROVAC AG
Reel/Frame 023890/0906 →
Change of Name
Mar 24, 2011
From: ELECTROVAC AG
To: CURAMIK HOLDING GMBH, IN LIQUIDATION
Reel/Frame 026015/0157 →
Change of Name
Jul 17, 2014
From: CURAMIK ELECTRONICS GMBH
To: ROGERS GERMANY GMBH
Reel/Frame 033347/0420 →