Waveguide interface with a launch transducer and a circular interface plate
A waveguide interface and a method of manufacturing is disclosed. The interface includes a support block that has a printed circuit board. A communication device is coupled to the circuit board. A launch transducer is positioned adjacent to and coupled to the communication device. The launch transducer includes one or more transmission lines in a first portion and at least one antenna element in a second portion. The antenna element radiates millimeter wave frequency signals. An interface plate coupled to the support block has a rectangular slot having predetermined dimensions. A waveguide component is coupled to the interface plate and has a waveguide opening. The first portion of the launch transducer is positioned within the slot such that the slot prevents energy from the transmission line from emitting toward the circuit board or the waveguide opening but allows energy to pass from the antenna element into the waveguide opening.
1. A waveguide interface comprising:
a launch transducer comprising one or more transmission lines in a first portion of the launch transducer and at least one antenna element coupled to the one or more transmission lines in a second portion of the launch transducer, wherein the at least one antenna element is configured to radiate millimeter wave frequency signals;
a support block including a printed circuit board, the support block oriented along a plane;
a communication device coupled to the printed circuit board, wherein the launch transducer is positioned adjacent to and coupled to the communication device;
a circular interface plate coupled to an end of the support block and oriented perpendicular to the plane, the interface plate having a rectangular slot having predetermined dimensions, wherein the interface plate is positioned flush against a standard waveguide flange such that the narrow dimension of the rectangular slot within the interface plate is orthogonal to a H-field dimension of the standard waveguide flange; and
a waveguide component coupled to the interface plate, the waveguide component having a waveguide opening, wherein the first portion of the launch transducer is positioned within the rectangular slot such that the rectangular slot prevents energy from the transmission line from being emitted toward the printed circuit board or the waveguide opening and allows energy to pass from the at least one antenna element into the waveguide opening.
2. The waveguide interface of claim 1 , wherein the printed circuit board contains a semiconductor chip configured to transmit and receive millimeter wave signals.
3. The waveguide interface of claim 1 , wherein the launch transducer further comprises a low-loss dielectric material with deposited metallization.
4. The waveguide interface of claim 1 wherein the launch transducer has an operating frequency range of 57 GHz to 66 GHz.
5. The waveguide interface of claim 1 , wherein the second portion of the launch transducer is positioned within the waveguide opening.
6. The waveguide interface of claim 1 , wherein the launch transducer is positioned near a top surface of the support block midway between opposing edges of the top surface of the support block.
7. The waveguide interface of claim 1 , wherein the communication device is positioned within a recess in the printed circuit board such that the first portion of the launch transducer is at a predetermined height within the rectangular slot.
8. The waveguide interface of claim 1 , wherein the launch transducer is configured to provide maximum energy radiation along a central axis of the waveguide component.
9. A method of forming a precision waveguide interface comprising:
providing a launch transducer comprising one or more transmission lines in a first portion of the launch transducer and at least one antenna element coupled to the one or more transmission lines in a second portion of the launch transducer, wherein the at least one antenna element is configured to radiate millimeter wave frequency signals;
selecting a support block including a printed circuit board, the support block oriented along a plane;
coupling a communication device to the printed circuit board;
coupling the launch transducer to the communication device, wherein the launch transducer is positioned adjacent to the communication device;
coupling a circular interface plate to an end of the support block and oriented perpendicular to the plane, the interface plate having a rectangular slot having predetermined dimensions, wherein the interface plate is positioned flush against a standard waveguide flange such that the narrow dimension of the rectangular slot within the interface plate is orthogonal to a H-field dimension of the standard waveguide flange; and
coupling a waveguide component to the interface plate, the waveguide component having a waveguide opening, wherein the first portion of the launch transducer is positioned within the rectangular slot such that the rectangular slot prevents energy from the transmission line from being emitted toward the printed circuit board or the waveguide opening and allows energy to pass from the at least one antenna element into the waveguide opening.
10. The method of claim 9 , wherein the printed circuit board contains a semiconductor chip configured to transmit and/or receive millimeter wave signals.
11. The method of claim 9 , wherein the launch transducer further comprises a low-loss dielectric material with deposited metallization.
12. The method of claim 9 wherein the launch transducer has an operating frequency range of 57 GHz to 66 GHz.
13. The method of claim 9 , wherein the printed circuit board and launch transducer are positioned such that the at least one antenna element is located within an area of a standard waveguide adjacent to the waveguide component.
14. The method of claim 9 , wherein the transducer is configured to provide maximum energy radiation along a central axis of the waveguide component axis.
15. The method of claim 9 , wherein the second portion of the launch transducer is positioned within the waveguide opening.
16. The method of claim 9 , wherein the launch transducer is positioned near a top surface of the support block midway between opposing edges of the top surface of the support block.
17. The method of claim 9 , wherein the communication device is positioned within a recess in the printed circuit board such that the first portion of the transducer is at a predetermined height within the rectangular slot.
18. The method of claim 9 , wherein the printed circuit board and the launch transducer are coplanar, wherein the launch transducer is at a predetermined height within the rectangular slot.
19. The method of claim 9 , wherein the printed circuit board and the launch transducer are coplanar, wherein the launch transducer is at a predetermined height within the rectangular slot.
20. A waveguide interface comprising:
a launch transducer comprising one or more transmission lines in a first portion of the launch transducer and at least one antenna element coupled to the one or more transmission lines in a second portion of the launch transducer, wherein the at least one antenna element is configured to radiate millimeter wave frequency signals;
a support block including a printed circuit board, the support block oriented along a plane;
a communication device coupled to the printed circuit board, wherein the launch transducer is positioned adjacent to and coupled to the communication device;
a circular interface plate coupled to an end of the support block and oriented perpendicular to the plane, the interface plate having a rectangular slot having predetermined dimensions; and
a waveguide component coupled to the interface plate, the waveguide component having a waveguide opening, wherein the first portion of the launch transducer is positioned within the rectangular slot such that the rectangular slot prevents energy from the transmission line from being emitted toward the printed circuit board or the waveguide opening and allows energy to pass from the at least one antenna element into the waveguide opening, wherein the printed circuit board and launch transducer are positioned such that the at least one antenna element is located within an area of a standard waveguide adjacent to the waveguide component.
21. The waveguide interface of claim 20 , wherein the printed circuit board contains a semiconductor chip configured to transmit and receive millimeter wave signals.
22. The waveguide interface of claim 20 , wherein the communication device is positioned within a recess in the printed circuit board such that the first portion of the launch transducer is at a predetermined height within the rectangular slot.
23. The waveguide interface of claim 20 , wherein the launch transducer is configured to provide maximum energy radiation along a central axis of the waveguide component.