IP Library Granted Patent US 9,182,359
Granted Patent B2
US 9,182,359 · App. 13/386,243 · Granted Nov 10, 2015

Apparatus and method for inspecting pattern defect

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,182,359
App. No.
13/386,243
Granted
Nov 10, 2015
Kind
B2
Abstract

Provided is a pattern defect inspecting apparatus wherein inspection performance is stabilized. The defect inspecting apparatus, which has a plurality of configuration units and inspects defects on the surface of a sample, is provided with a means for monitoring time-dependent changes and failures of some of or all of the configuration units, and a means for notifying the user of the results of the monitoring. Furthermore, a unit which can perform correction is provided with a correcting means, and also a means for replacing a failure component with a spare component which has been prepared in the device.

Claims (16)

1. A defect inspection apparatus to inspect for a defect on a surface of a sample, the defect inspection apparatus comprising:

a plurality of configuration units including a detector and a light irradiation system to output a standard light;

a status monitoring system to monitor a time dependent change of the performance of the detector by comparing a luminance of the standard light that the detector detects with a predetermined luminance; and

a notification system to receive and display a result of the status monitoring system for each of the plurality of configuration units and including a system to process a signal output from the detector.

2. The defect inspection apparatus according to claim 1 , further including;

an observation system which acquires at least one of dark field image and a bright field image; and

an illumination system for the observation system.

3. A defect inspection apparatus to inspect for a defect on a surface of a sample, the defect inspection apparatus comprising:

a plurality of configuration units including a signal processing circuit;

a status monitoring unit to monitor a time dependent change of the performance of the signal processing circuit wherein the status monitoring unit for monitoring the signal processing circuit is a substrate in which test data for performing an operation test on the signal processing circuit is stored; and

a notification system to receive and display a result of the status monitoring unit for each of the plurality of configuration units.

4. The defect inspection apparatus according to claim 3 , further including;

an observation system which acquires at least one of dark field image and a bright field image; and

an illumination system for the observation system.

5. The defect inspection apparatus according to claim 3 , further comprising a signal switching system for switching a signal path to a normal signal processing circuit from a malfunctioning signal processing circuit.

6. The defect inspection apparatus according to claim 5 , further comprising a system for replacing the malfunctioning signal processing circuit without stopping an electric supply to the signal processing circuit.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →