Light-reflective anisotropic conductive adhesive and light-emitting device
A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The light-reflective insulating particles are at least one of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, and aluminum oxide, or resin-coated metal particles formed by coating the surface of scale-like or spherical metal particles with an insulating resin.
1. A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board, comprising a thermosetting resin composition, conductive particles, and light-reflective insulating particles, wherein
the light-reflective insulating particles are boron nitride particles, and
the conductive particle comprises a light-reflective conductive particle formed from a core particle coated with a metal material, and a light-reflecting layer formed on a surface of the core particle, the light-reflecting layer being a multilayer structure formed from a thermoplastic resin and zinc oxide particles, the thermoplastic resin being a composition that is colorless and transparent such that the thermoplastic resin exhibits a light transmittance (JIS K7105) of 80% or more at a 1 cm light path length of visible light having a wavelength of 380 to 780 nm.
2. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the light-reflective insulating particle has a refractive index (JIS K7142) that is greater than a refractive index (JIS K7142) of a cured product of the thermosetting resin composition.
3. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the light-reflective insulating particle is a resin-coated metal particle formed by coating a surface of a scale-like or spherical particle with an insulating resin.
4. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein an amount of the light-reflective insulating particles in the light-reflective anisotropic conductive adhesive is 1 to 50% by volume.
5. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the thermosetting resin composition includes an epoxy resin and an acid anhydride curing agent.
6. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein an amount of the light-reflective conductive particles is 1 to 100 parts by mass based on 100 parts by mass of the thermosetting resin composition.
7. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the thermoplastic resin exhibits a light transmittance (JIS K7105) of 90% or more at a 1 cm light path length of visible light having a wavelength of 380 to 780 nm.
8. A light-emitting device comprising a wiring board and a light-emitting element flip-chip-mounted thereon through the light-reflective anisotropic conductive adhesive according to claim 1 provided therebetween.
9. The light-emitting device according to claim 8 , wherein the light-emitting element is a light-emitting diode.