High Aspect Ratio Patterning of Silicon

1 . An method comprising:

disposing a noble metal on a substrate comprising silicon;

selectively etching portions of the substrate with an etching solution, thereby forming a nanowire array comprising a multiplicity of silicon nanowires extending from the substrate, wherein selectively etching portions of the substrate comprises etching silicon in contact with the noble metal.

2 . The method of claim 1 , wherein disposing the noble metal on the substrate comprises forming a metal-containing layer on the substrate, the metal-containing layer comprising the noble metal, and further comprising:

disposing a polymerizable composition on the metal-containing layer;

contacting the polymerizable composition with a patterned imprint lithography template;

solidifying the polymerizable composition to form a patterned layer on the substrate, the patterned layer comprising protrusions and recessions;

separating the imprint lithography template from the patterned layer; and

removing portions of the patterned layer in the recessions to expose portions of the metal-containing layer,

wherein selectively etching portions of the substrate with the etching solution comprises contacting the exposed portions of the metal-containing layer with the etching solution.

3 . The method of claim 2 , wherein removing portions of the patterned layer comprises in the recessions to expose portions of the metal-containing layer comprises exposing the portions of the patterned layer in the recessions to vacuum ultraviolet radiation.

4 . The method of claim 1 , wherein disposing the noble metal on the substrate comprises disposing a polymerizable composition on a silicon substrate, wherein the polymerizable composition comprises the noble metal, and further comprising:

contacting the polymerizable composition with a patterned imprint lithography template;

solidifying the polymerizable composition to form a patterned metal-containing layer on the substrate, the patterned metal-containing layer comprising protrusions and recessions;

separating the imprint lithography template from the patterned metal-containing layer; and

removing portions of the patterned metal-containing layer in the recessions, leaving metal-rich regions between the protrusions,

wherein selectively etching portions of the substrate with the etching solution comprises contacting the metal-rich regions between the protrusions with the etching solution.

5 . The method of claim 1 , further comprising, before disposing the noble metal on the substrate:

disposing a polymerizable composition on the silicon substrate;

contacting the polymerizable composition with a patterned imprint lithography template;

solidifying the polymerizable composition to form a patterned layer on the substrate, the patterned layer comprising protrusions and recessions;

separating the imprint lithography template from the patterned layer; and

removing portions of the patterned layer to expose portions of the silicon substrate,

wherein the etching solution comprises the noble metal, and disposing the noble metal on the substrate comprises contacting the exposed portions of the substrate with the etching solution.

6 . The method of claim 1 , further comprising, before disposing the noble metal on the substrate:

disposing a polymerizable composition on the silicon substrate;

contacting the polymerizable composition with a patterned imprint lithography template;

solidifying the polymerizable composition to form a patterned layer on the substrate, the patterned layer comprising protrusions and recessions;

separating the imprint lithography template from the patterned layer; and

removing portions of the patterned layer to expose portions of the silicon substrate,

wherein disposing the noble metal on the substrate comprises applying the noble metal to the exposed portions of the silicon substrate, and selectively etching portions of the substrate with the etching solution comprises contacting the noble metal applied to the exposed portions of the silicon substrate with the etching solution.

7 . The method of claim 1 , wherein the noble metal comprises noble metal ions.

8 . The method of claim 1 , wherein the etching solution comprises hydrofluoric acid.

9 . The method of claim 1 , further comprising forming one or more additional layers on the substrate before disposing the noble metal on the substrate.

10 . The method of claim 1 , further comprising reducing some of the noble metal in contact with the silicon.

11 . The method of claim 1 , wherein forming the nanowire array comprises forming nanowires with an aspect ratio of at least 10:1.

12 . The method of claim 1 , wherein etching the silicon in contact with the noble metal comprises electroless etching.

13 . The method of claim 1 , further comprising removing non-silicon-containing material from the distal ends of the nanowires.

14 . A silicon nanowire array fabricated by the method of claim 1 .

15 . A silicon nanowire array comprising a multiplicity of silicon nanowires extending from a silicon substrate, wherein a critical dimension of the nanowires is between 10 nm and 500 nm, a pitch of the nanowires is between 100 nm and 1 μm, and a length of the nanowires is between 5 nm and 20 μm.

16 . The silicon nanowire array of claim 15 , wherein the aspect ratio of the nanowires is at least 10:1.

17 . The silicon nanowire array of claim 15 , wherein a cross-sectional shape of the nanowires is circular, elliptical, triangular, rectangular, hexagonal, lobed, or in the shape of a square or parallelogram.

18 . The silicon nanowire array of claim 15 , wherein a length of the nanowires is at least 50 nm.

19 . The silicon nanowire array of claim 15 , wherein the nanowire array is formed in an electroless etching process.

20 . A lithium ion battery comprising an electrode, the electrode comprising the silicon nanowire array of claim 15 .