IP Library Granted Patent US 9,390,998
Granted Patent B2
US 9,390,998 · App. 13/399,952 · Granted Jul 12, 2016

Heat spreading substrate

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Quick Facts
Patent No.
US 9,390,998
App. No.
13/399,952
Granted
Jul 12, 2016
Kind
B2
Abstract

Heat spreading substrate. In accordance with an embodiment of the present invention, an apparatus includes a thermally conductive, electrically insulating regular solid, a first electrically conductive coating mechanically coupled to a first edge of the regular solid and a second electrically conductive coating mechanically coupled to a second edge of the regular solid. The first and the second electrically conductive coatings are electrically isolated from one another and the faces of the first electrically conductive coating, the second electrically conductive coating and the regular solid are substantially co-planar. The primary and secondary surfaces of the regular solid may be free of electrically conductive materials.

Claims (46)

1. An apparatus comprising:

a thermally conductive, electrically insulating solid;

a first electrically conductive coating mechanically coupled to a first edge of said solid;

a second electrically conductive coating mechanically coupled to a second edge of said solid;

wherein said first and said second electrically conductive coatings are electrically isolated from one another; and

wherein faces of said first electrically conductive coating, said second electrically conductive coating and said solid are substantially coplanar.

2. The apparatus of claim 1 wherein the primary and secondary surfaces of said solid are free of electrically conductive materials.

3. The apparatus of claim 1 wherein said thermally conductive, electrically insulating solid is configured for mounting a body of an electronic device.

4. The apparatus of claim 1 wherein said first electrically conductive coating and said second electrically conductive coating are configured for conducting electrical signals to contacts of an electronic device.

5. The apparatus of claim 1 further comprising a plurality of electronic devices wire bonded to said first electrically conductive coating.

6. The apparatus of claim 1 further comprising a plurality of electronic devices surface mounted to said first electrically conductive coating.

7. The apparatus of claim 1 further comprising a light emitting diode.

8. The apparatus of claim 7 further comprising:

a base for coupling to an alternating current supply; and

electronics configured to convert said alternating current to electrical power suitable for driving said light emitting diode.

9. The apparatus of claim 8 further comprising at least two light emitting diodes mounted on the same said thermally conductive, electrically insulating solid.

10. The apparatus of claim 7 further comprising:

a processor for operating a graphical user interface;

a display for displaying said graphical user interface; and

wherein said light emitting diode is configured to illuminate said display.

11. The apparatus of claim 1 further comprising radio frequency circuitry.

12. The apparatus of claim 1 further comprising a power semiconductor device.

13. An apparatus comprising:

a thermally and electrically conducting solid;

a first insulating coating mechanically coupled to a first edge of said solid;

a first electrically conductive coating mechanically coupled to said first insulating coating;

a second insulating coating mechanically coupled to a second edge of said solid;

a second electrically conductive coating mechanically coupled to said second insulating coating;

wherein said first and said second electrically conductive coatings are electrically isolated from one another; and

wherein faces of said first and electrically conductive coatings, said first and second insulating coatings and said solid are substantially co-planar.

14. The apparatus of claim 13 wherein primary and secondary surfaces of said thermally and electrically conducting solid are exposed.

15. The apparatus of claim 13 wherein said first electrically conductive coating and said second electrically conductive coating are configured for making electrical contact with contacts of an electronic device.

16. The apparatus of claim 13 wherein said thermally and electrically conducting solid is configured for conducting electrical signals to said contacts of an electronic device.

17. The apparatus of claim 13 further comprising a plurality of electronic devices having electronic device bodies.

18. The apparatus of claim 17 wherein said plurality of electronic devices are surface mounted to said first electrically conductive coating.

19. The apparatus of claim 17 comprising a wire bond coupling and a surface mount coupling.

20. The apparatus of claim 17 comprising a surface mount coupling to said thermally and electrically conducting regular solid.

21. The apparatus of claim 17 wherein said plurality of electronic devices comprise a light emitting diode.

22. The apparatus of claim 21 further comprising: a base for coupling to an alternating current supply; and

electronics configured to convert said alternating current to electrical power suitable for driving said light emitting diode.

23. The apparatus of claim 21 further comprising:

a processor for operating a graphical user interface;

a display for displaying said graphical user interface; and

wherein said light emitting diode is configured to illuminate said display.

24. The apparatus of claim 17 wherein said plurality of electronic devices comprise radio frequency circuitry.

25. The apparatus of claim 17 wherein said plurality of electronic devices comprise a power semiconductor device.

Assignments (6)
CHANGE OF NAME Recorded Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073689/0754 →
CHANGE OF NAME Recorded Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073689/0786 →
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.; VEVEO, INC.; INVENSAS CORPORATION; INVENSAS BONDING TECHNOLOGIES, INC.; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2012
From: GUEVARA, GABRIEL Z.; MOHAMMED, ILYAS; WANG, LIANG
To: INVENSAS CORPORATION
Reel/Frame 028322/0760 →