Semiconductor package repair process
An electronic package implemented in an electronic device may include a damaged connection that restricts electrical communication between components in the electronic package. For example, the damaged connection may restrict communication between a silicon unit, such as a processor die for example, and a printed circuit board. The damaged connection may be repaired without damaging other components in the electronic package by using a repair apparatus that includes a heating element and a cooling element. The heating element may be activated to transfer heat to the electronic package for reforming the damaged connection between components to enable effective electrical communication. The cooling element may be activated for cooling components in the electronic package to prevent damage due to the transfer of the heat from the heating element. The heating element and/or the cooling element may be activated in a predetermined pattern to facilitate the repair of the damaged connection.
1. A method for repairing a damaged connection between a first component and a second component in an electronic package comprising a plurality of components, wherein the damaged connection restricts effective electrical communication between the first component and the second component, the method comprising:
placing the electronic package into a repair apparatus that includes at least one heating element that is aligned with the damaged connection and at least one cooling element;
activating the at least one heating element to transfer heat to the electronic package for reforming the damaged connection between the first component and the second component to enable effective electrical communication between the first component and the second component; and
activating the at least one cooling element for cooling at least one component, of the plurality of components in the electronic package, to prevent damage due to the transfer of the heat from the at least one heating element.
2. The method of claim 1 , wherein the first component comprises a die and the second component comprises a printed circuit board.
3. The method of claim 2 , wherein the at least one component comprises the printed circuit board, and wherein the at least one cooling element is activated for cooling the printed circuit board to prevent damage to the printed circuit board due to the transfer of the heat from the at least one heating element.
4. The method of claim 2 , further comprising applying the at least one heating element to the die, and wherein the at least one heating element is applied at a predetermined temperature and for a predetermined period of time based on a size of the die.
5. The method of claim 2 , wherein the damaged connection is reformed without removing the printed circuit board from the electronic package.
6. The method of claim 1 , wherein the at least one heating element and the at least one cooling element are each activated at a predetermined temperature or a predetermined frequency.
7. The method of claim 1 , wherein the at least one heating element transfers heat to the electronic package such that the damaged connection is reformed without the heating element contacting the electronic package.
8. The method of claim 1 , further comprising testing the electronic package to confirm that the damaged connection between the first component and the second component has been reformed to enable the effective electrical communication between the first component and the second component.
9. The method of claim 1 , further comprising applying the heat to the electronic package at a lateral angle to enable reform of the damaged connection.
10. The method of claim 1 , wherein the damaged connection comprises a soldering joint.
11. The method of claim 1 , wherein the electronic package comprises at least one portion of a graphics card or a motherboard of a gaming console.
12. The method of claim 1 , wherein the first component comprises a die and the second component comprises a substrate, and wherein the electronic package further comprises another connection between the substrate and a printed circuit board.
13. The method of claim 12 , wherein a melting point of the damaged connection is greater than a melting point of the other connection, and wherein the at least one cooling element is activated for cooling the other connection to prevent damage due to the transfer of the heat from the at least one heating element.
14. The method of claim 1 , wherein the at least one cooling element comprises tetrafluoroethane, dichlorodifluoromethane, pentafluoroethane, liquid nitrogen, or air.
15. An apparatus for repairing a damaged connection between a first component and a second component in an electronic package comprising a plurality of components, wherein the damaged connection restricts effective electrical communication between the first component and the second component, the apparatus comprising:
at least one heating element, being aligned with the damaged connection, that is configured to transfer heat to the electronic package for reforming the damaged connection between the first component and the second component to enable effective electrical communication between the first component and the second component; and
at least one cooling element, being aligned with the damaged connection, that is configured to cool at least one component, of the plurality of components in the electronic package, to prevent damage due to the transfer of the heat from the at least one heating element.
16. The apparatus of claim 15 , wherein the at least one cooling element comprises a tank that includes a coolant capable of cooling the at least one component, of the plurality of components in the electronic package, to prevent damage due to the transfer of the heat from the at least one heating element.
17. The apparatus of claim 16 , wherein the coolant comprises tetrafluoroethane, dichlorodifluoromethane, pentafluoroethane, liquid nitrogen, or air.
18. The apparatus of claim 16 , further comprising a control module used to control the release of the coolant in the tank.
19. The apparatus of claim 18 , wherein the control module comprises a sensor that indicates a current temperature such that the control module may maintain a temperature below a threshold.
20. The apparatus of claim 15 , wherein the first component comprises a die and the second component comprises a printed circuit board.
21. The apparatus of claim 15 , wherein the damaged connection comprises a soldering joint.