Inspecting method and inspecting apparatus for substrate surface
View Patent ↗An inspecting method and apparatus for inspecting a substrate surface includes application of a light to the substrate surface, detection of scattered light or reflected light from the substrate surface due to the applied light at a plurality of positions to obtain a plurality of electrical signals, extraction of a signal in a mutually different frequency band from each of the plurality of electrical signals, and calculation of a value regarding a state of film of the substrate through an arithmetical operation process of a plurality of extracted signals in the frequency bands.
1. An inspecting method for inspecting a substrate surface, characterized by including:
a first step of applying a light to the substrate surface having a film;
a second step of detecting a scattered light or reflected light from the substrate surface due to the applied light at a plurality of positions to obtain a plurality of electrical signals;
a third step of extracting a signal in a mutually different frequency band from each of the plurality of electrical signals; and
a fourth step of calculating a value regarding a state of the film of the substrate through an arithmetical operation process of a plurality of extracted signals in the frequency bands.
2. The inspecting method according to claim 1 , characterized in that the third step includes extracting the signal in the frequency band preprogrammed for each of the plurality of electrical signals.
3. The inspecting method according to claim 1 , characterized in that the second step includes detecting the scattered light or reflected light from the substrate surface using a plurality of detectors disposed at positions with mutually different elevation angles.
4. The inspecting method according to claim 1 , characterized in that the state of the film is a state of film thickness or a state of film materials.
5. The inspecting method according to claim 1 , characterized in that the fourth step includes calculating a value regarding a state of the film of the substrate and a state of surface roughness of the substrate.
6. The inspecting method according to claim 5 , characterized in that the predetermined database is each of the state of surface roughness of the substrate and the state of the film of the substrate.
7. The inspecting method according to claim 1 , characterized in that the fourth step includes estimating a state of the film of the substrate and a state of surface roughness of the substrate at the same time.
8. The inspecting method according to claim 7 , characterized in that the fourth step includes estimating the state of the film of the substrate and the state of surface roughness of the substrate based on predetermined database.
9. The inspecting method according to claim 8 , characterized in that the predetermined database indicates a relation of the signal extracted by the third step and the state of the film.
10. An inspecting apparatus for inspecting a substrate surface, characterized by including:
a light applicator which applies a light to the substrate surface having a film;
a detector which detects a scattered light or reflected light from the substrate surface due to the applied light at a plurality of positions to obtain a plurality of electrical signals;
an extractor which extracts a signal in a mutually different frequency band from each of the plurality of electrical signals; and
a calculator which calculates a value regarding a state of the film of the substrate through an arithmetical operation process of a plurality of extracted signals in the frequency bands.
11. The inspection apparatus according to claim 10 , characterized in the extractor extracts the signal in the frequency band preprogrammed for each of the plurality of electrical signals.
12. The inspecting apparatus according to claim 10 , characterized in that the detector detects the scattered light or reflected light from the substrate surface using a plurality of detection units disposed at positions with mutually different elevation angles.
13. The inspecting apparatus according to claim 10 , characterized in that the state of the film is a state of film thickness or a state of film materials.
14. The inspecting apparatus according to claim 10 , characterized in that the calculator calculates a value regarding a state of the film of the substrate and a state of surface roughness of the substrate.
15. The inspecting apparatus according to claim 14 , wherein the predetermined database is each of the state of surface roughness of the substrate and the state of film of the substrate.
16. The inspecting apparatus according to claim 10 , characterized in that the calculator estimates a state of the film of the substrate and a state of surface roughness of the substrate at the same time.
17. The inspecting apparatus according to claim 16 , characterized in that the calculator estimates the state of the film of the substrate and the state of surface roughness of the substrate based on predetermined database.
18. The inspecting apparatus according to claim 17 , wherein the predetermined database indicates a relation of the signal extracted by the extractor and the state of the film.