IP Library Granted Patent US 9,250,664
Granted Patent B2
US 9,250,664 · App. 13/404,761 · Granted Feb 2, 2016

IHS component cooling system

Inventors: Paul T. Artman (Austin, TX); Dominick Adam Lovicott (Round Rock, TX); Hasnain Shabbir (Round Rock, TX)
Assignee: Dell Products L.P.
G06F1/206G06F1/203Y02B60/1275
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,250,664
App. No.
13/404,761
Filed
Feb 24, 2012
Granted
Feb 2, 2016
Kind
B2
Art Unit
2121
USPC
700/300
Abstract

An IHS includes an IHS chassis. A processor is located in the IHS chassis. At least one fan is located in the IHS chassis and in fluid communication with the processor. A temperature sensor is located in the IHS chassis. A fan controller is coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature. The fan controller is operable to receive a first ambient temperature from the temperature sensor, determine a first processor target temperature that is associated with the first ambient temperature, receive a temperature of the processor, and operate the at least one fan in order to reduce the temperature of the processor to the first processor target temperature.

Claims (103)

1. An information handling system (IHS) component cooling system, comprising:

an IHS component;

at least one fan in fluid communication with the IHS component; and

a fan controller coupled to the IHS component, the at least one fan, and a storage device that includes a plurality IHS component target temperatures that are each associated with a different ambient temperature, wherein the fan controller is operable to:

receive a first ambient temperature;

determine a first IHS component target temperature that is associated with the first ambient temperature and that is at least 15 degrees Celsius below a control temperature of the IHS component;

receive a first temperature of the IHS component;

operate the at least one fan in order to reduce the first temperature of the IHS component to the first IHS component target temperature;

receive a second ambient temperature;

determine a second IHS component target temperature that is associated with the second ambient temperature, that is different than the first IHS component target temperature, and that is at most 5 degrees Celsius below the control temperature of the IHS component;

receive a second temperature of the IHS component; and

operate the at least one fan in order to reduce the second temperature of the IHS component to the second IHS component target temperature.

2. The system of claim 1 , wherein the plurality of IHS component target temperatures that are each associated with a different ambient temperature are included in a continuous IHS component target temperature function that is a function of ambient temperature.

3. The system of claim 1 , further comprising:

a temperature sensor coupled to the fan controller and operable to provide the first ambient temperature to the fan controller.

4. The system of claim 1 , wherein the plurality of IHS component target temperatures include a first set of IHS component target temperatures that are each associated with a first IHS component property and a second set of IHS component target temperatures that are each associated with a second IHS component property.

5. The system of claim 1 , wherein in response to operating the at least one fan in order to reduce the temperature of the IHS component to the first IHS component target temperature, a total system power consumption is minimized, and wherein the total system power consumption includes a first power that is consumed by the at least one fan and a second power that is consumed by the IHS component.

6. An information handling system (IHS) component cooling system, comprising:

an IHS component;

at least one fan in fluid communication with the IHS component; and

a fan controller coupled to the IHS component, the at least one fan, and a storage device that includes a plurality IHS component target temperatures that are each associated with a different ambient temperature and that include a first set of IHS component target temperatures that are each associated with a first IHS component thermal design power and a second set of IHS component target temperatures that are each associated with a second IHS component thermal design power, wherein the fan controller is operable to:

receive a first ambient temperature;

determine a first IHS component target temperature that is associated with the first ambient temperature;

receive a temperature of the IHS component;

operate the at least one fan in order to reduce the temperature of the IHS component to the first IHS component target temperature.

7. An information handling system (IHS) component cooling system, comprising:

an IHS component;

at least one fan in fluid communication with the IHS component; and

a fan controller coupled to the IHS component, the at least one fan, and a storage device that includes a plurality IHS component target temperatures that are each associated with a different ambient temperature, wherein the fan controller is operable to:

receive a first ambient temperature;

determine a first IHS component target temperature that is associated with the first ambient temperature and that is below a control temperature of the IHS component;

receive a first temperature of the IHS component;

operate the at least one fan in order to reduce the first temperature of the IHS component to the first HS component target temperature:

receive a second ambient temperature;

determine a second IHS component target temperature that is associated with the second ambient temperature, that is different than the first IHS component target temperature, and that is above the control temperature of the IHS component;

receive a second temperature of the IHS component; and

operate the at least one fan in order to reduce the second temperature of the IHS component to the second IHS component target temperature.

8. An information handing system, comprising:

an IHS chassis;

a processor located in the IHS chassis;

at least one fan located in the IHS chassis and in fluid communication with the processor;

a temperature sensor located in the IHS chassis; and

a fan controller coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature, wherein the fan controller is operable to:

receive a first ambient temperature from the temperature sensor;

determine a first processor target temperature that is associated with the first ambient temperature and that is at least 15 degrees Celsius below a control temperature of the processor;

receive a first temperature of the processor;

operate the at least one fan in order to reduce the first temperature of the processor to the first processor target temperature;

receive a second ambient temperature from the temperature sensor;

determine a second processor target temperature that is associated with the second ambient temperature, that is different than the first processor target temperature and that is a 5 degrees Celsius below the control temperature of the processor;

receive a second temperature of the processor; and

operate the at least one fan in order to reduce the second temperature of the processor to the second processor target temperature.

9. The IHS of claim 8 , wherein the plurality of processor target temperatures that are each associated with a different ambient temperature are included in a continuous processor target temperature function that is a function of ambient temperature.

10. The IHS of claim 8 , wherein the plurality of processor target temperatures include a first set of processor target temperatures that are each associated with a first processor thermal design power and a second set of processor target temperatures that are each associated with a second processor thermal design power.

11. The IHS of claim 8 , wherein in response to operating the at least one fan in order to reduce the temperature of the processor to the first processor target temperature, a total system power consumption is minimized, and wherein the total system power consumption includes a first power that is consumed by the at least one fan and a second power that is consumed by the processor and that includes a processor leakage power.

12. An information handing system, comprising:

an IHS chassis;

a processor located in the IHS chassis;

at least one fan located in the IHS chassis and in fluid communication with the processor;

a temperature sensor located in the IHS chassis; and

a fan controller coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature and that include a first set of processor target temperatures that are each associated with a processor thermal design power and a second set of processor target temperatures that are each associated with a second processor thermal design power, wherein the fan controller is operable to:

receive a first ambient temperature from the temperature sensor;

determine a first processor target temperature that is associated with the first ambient temperature;

receive a temperature of the processor; and

operate the at least one fan in order to reduce the temperature of the processor to the first processor target temperature.

13. An information handing system comprising:

an IHS chassis;

a processor located in the IHS chassis;

at least one fan located in the IHS chassis and in fluid communication with the processor;

a temperature sensor located in the IHS chassis; and

a fan controller coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature, wherein the fan controller is operable to:

receive a first ambient temperature from the temperature sensor;

determine a first processor target temperature that is associated with the first ambient temperature and that is below a control temperature of the processor;

receive a first temperature of the processor;

operate the at least one fan in order to reduce the first temperature of the processor to the first processor target temperature;

receive a second ambient temperature from the temperature sensor;

determine a second processor target temperature that is associated with the second ambient temperature, that is different than the first processor target temperature, and that is above the control temperature of the processor;

receive a second temperature of the processor; and

operate the at least one fan in order to reduce the second temperature of the processor to the second processor target temperature.

14. A method for processor cooling, comprising:

receiving a first ambient temperature from a temperature sensor;

determining a first processor target temperature from a plurality of processor target temperatures that are stored in a storage device and each associated with a different ambient temperature, wherein the first processor target temperature is at least 15 degrees Celsius below a control temperature of the processor and is associated with and determined using the first ambient temperature;

receiving a first temperature of a processor;

operating at least one fan in order to reduce the first temperature of the processor to the first processor target temperature such that a total system power consumption is minimized, wherein the total system power consumption includes a first power that is consumed by the at least one fan and a second power that is consumed by the processor and that includes a processor leakage power;

receiving a second ambient temperature from the temperature sensor;

determining a second processor target temperature from the plurality of processor target temperatures that are stored in the storage device and each associated with a different ambient temperature wherein the second processor target temperature, is at most 5 degrees Celsius below the control temperature of the processor and is associated with and determined using the second ambient temperature;

receiving a second temperature of the processor; and

operating the at least one fan in order to reduce the second temperature of the processor to the second processor target temperature such that a total system power consumption is minimized.

15. The method of claim 14 , wherein the plurality of processor target temperatures include a first set of processor target temperatures that are each associated with a first processor thermal design power and a second set of processor target temperatures that are each associated with a second processor thermal design power, and wherein the method further comprises:

determining that the processor includes a first processor thermal design power, wherein the determining the first processor target temperature using the first ambient temperature includes using the first ambient temperature and the first processor thermal design power to determine the first processor target temperature from the first set of processor target temperatures.

16. A method for processor cooling, comprising:

receiving a first ambient temperature from a temperature sensor;

determining a first processor target temperature from a plurality of processor target temperatures that are stored in a storage device, that are each associated with a different ambient temperature, and that include a first set of processor target temperatures that are each associated with a first processor thermal design power and a second set of processor target temperatures that are each associated with a second processor thermal design power, wherein the first processor target temperature is associated with and determined using the first ambient temperature and a first processor thermal design power from the first set of processor target temperatures;

receiving a temperature of a processor; and

operating at least one fan in order to reduce the temperature of the processor to the first processor target temperature such that a total system power consumption is minimized, wherein the total system power consumption includes a first power that is consumed by the at least one fan and a second power that is consumed by the processor and that includes a processor leakage power.

17. A method for processor cooling, comprising:

receiving a first ambient temperature from a temperature sensor;

determining a first processor target temperature from a plurality of processor target temperatures that are stored in a storage device and each associated with a different ambient temperature, wherein the first processor target temperature is below a control temperature of the processor and is associated with and determined using the first ambient temperature;

receiving a first temperature of a processor;

operating at least one fan in order to reduce the first temperature of the processor to the first processor target temperature such that a total system power consumption is minimized, wherein the total system power consumption includes a first power that is consumed by the at least one fan and a second power that is consumed by the processor and that includes a processor leakage power;

receiving a second ambient temperature from the temperature sensor;

determining a second processor target temperature from the plurality of processor target temperatures that are stored in the storage device and each associated with a different ambient temperature, wherein the second processor target temperature is above the control temperature of the processor and is associated with and determined using the second ambient temperature;

receiving a second temperature of the processor; and

operating the at least one fan in order to reduce the second temperature of the processor to the second target temperature such that a total a system power consumption is minimized.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040040/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0618 →
RELEASE OF SECURITY INTEREST Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLANT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0216 →
PATENT SECURITY AGREEMENT (ABL) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031898/0001 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031899/0261 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jan 2, 2014
From: APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 031897/0348 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2012
From: ARTMAN, PAUL T.; LOVICOTT, DOMINICK ADAM; SHABBIR, HASNAIN
To: DELL PRODUCTS L.P.
Reel/Frame 027760/0331 →
Continuity (1)
Related Publication 20130226364A1 · Aug 29, 2013