Semiconductor light emitting device and semiconductor wafer
View Patent ↗According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer and configured to emit a light having a peak wavelength of 440 nanometers or more. Tensile strain is applied to the first semiconductor layer. An edge dislocation density of the first semiconductor layer is 5×10 9 /cm 2 or less. A lattice mismatch factor between the first semiconductor layer and the light emitting layer is 0.11 percent or less.
1. A semiconductor light emitting device comprising:
a first semiconductor layer of a first conductivity type;
a second semiconductor layer of a second conductivity type; and
a light emitting layer provided between the first semiconductor layer and the second semiconductor layer and configured to emit a light having a peak wavelength of 440 nanometers or more,
tensile strain in a direction perpendicular to a direction from the first semiconductor layer toward the second semiconductor layer being applied to the first semiconductor layer,
an edge dislocation density of the first semiconductor layer being 5×10 9 /cm 2 or less, the edge dislocation density being obtained from a rocking curve half width of a symmetry plane and an asymmetry plane of the first semiconductor layer in X-ray diffraction measurement, and
a lattice mismatch factor between the first semiconductor layer and the light emitting layer being 0.11 percent or less.
2. The device according to claim 1 , further comprising:
a silicon substrate, the first semiconductor layer being disposed between the silicon substrate and the second semiconductor layer; and
a buffer layer provided between the silicon substrate and the first semiconductor layer and including a nitride semiconductor.
3. The device according to claim 2 ,
wherein the buffer layer includes:
a first foundation layer provided between the silicon substrate and the first semiconductor layer and including AlN;
a second foundation layer provided between the first foundation layer and the first semiconductor layer and including Al x1 Ga 1-x1 N (0≦x1≦1);
a third foundation layer provided between the second foundation layer and the first semiconductor layer and including GaN; and
a fourth foundation layer provided between the third foundation layer and the first semiconductor layer and including a plurality of AlN layers and a plurality of GaN layers alternately stacked.
4. The device according to claim 3 , wherein number of the plurality of AlN layers of the fourth foundation layer and number of the plurality of GaN layers of the fourth foundation layer are not less than 2 and not more than 10.
5. The device according to claim 3 ,
wherein the fourth foundation layer further includes an AlGaN layer provided between each of the plurality of GaN layers and the AlN layer on a silicon substrate side of each of the plurality of GaN layers.
6. The device according to claim 1 ,
wherein the light emitting layer has a well layer including In and an average In composition ratio of the light emitting layer is 0.05 or more.
7. The device according to claim 1 , wherein
the light emitting layer includes a plurality of barrier layers and a well layer provided between the plurality of barrier layers,
the barrier layers include GaN, and
the well layer includes In wo Ga 1-w0 N (0<w0<1).
8. The device according to claim 7 , wherein the well layer is provided in a plurality.
9. The device according to claim 1 , wherein the first conductivity type is an n-type and the second conductivity type is p-type.
10. The device according to claim 1 , wherein the first semiconductor layer, the second semiconductor layer and the light emitting layer include a nitride semiconductor.
11. The device according to claim 1 , further comprising a support substrate,
the second semiconductor layer being disposed between the support substrate and the light emitting layer.
12. A semiconductor wafer comprising:
a silicon substrate;
a buffer layer provided on the silicon substrate;
a first semiconductor layer of a first conductivity type provided on the buffer layer;
a light emitting layer provided on the first semiconductor layer and configured to emit a light having a peak wavelength of 440 nanometer or more; and
a second semiconductor layer of a second conductivity type provided on the light emitting layer,
tensile strain in a direction perpendicular to a direction from the first semiconductor layer toward the second semiconductor layer being applied to the first semiconductor layer,
an edge dislocation density of the first semiconductor layer being 5×10 9 /cm 2 or less, the edge dislocation density being obtained from a rocking curve half width of a symmetry plane and an asymmetry plane of the first semiconductor layer in X-ray diffraction measurement, and
a lattice mismatch factor between the first semiconductor layer and the light emitting layer being 0.11 percent or less.
13. The wafer according to claim 12 ,
wherein the buffer layer includes:
a first foundation layer provided between the silicon substrate and the first semiconductor layer and including AlN;
a second foundation layer provided between the first foundation layer and the first semiconductor layer and including Al x1 Ga 1-x1 N (0≦x1≦1);
a third foundation layer provided between the second foundation layer and the first semiconductor layer and including GaN; and
a fourth foundation layer provided between the third foundation layer and the first semiconductor layer and including a plurality of AlN layers and a plurality of GaN layers alternately stacked.
14. The wafer according to claim 13 , wherein number of the plurality of AlN layers of the fourth foundation layer and number of the plurality of GaN layers of the fourth foundation layer are not less than 2 and not more than 10.
15. The wafer according to claim 13 ,
wherein the fourth foundation layer further includes an AlGaN layer provided between each of the plurality of GaN layers and the AlN layer on a silicon substrate side of each of the plurality of GaN layers.
16. The wafer according to claim 12 ,
wherein the light emitting layer has a well layer including In and an average In composition ratio of the light emitting layer is 0.05 or more.
17. The wafer according to claim 12 , wherein
the light emitting layer includes a plurality of barrier layers and a well layer provided between the plurality of barrier layers,
the barrier layers include GaN, and
the well layer includes In wo Ga 1-w0 N (0<w0<1).
18. The wafer according to claim 12 , wherein the first conductivity type is an n-type and the second conductivity type is p-type.
19. The wafer according to claim 12 , wherein the first semiconductor layer, the second semiconductor layer and the light emitting layer include a nitride semiconductor.
20. The wafer according to claim 12 , further comprising:
a low impurity concentration layer provided between the buffer layer and the first semiconductor layer,
an impurity concentration in the low impurity concentration layer being lower than an impurity concentration in the first semiconductor layer.
21. The device according to claim 1 , further comprising:
a low impurity concentration layer, the first semiconductor layer being provided between the first low impurity concentration layer and the light emitting layer,
an impurity concentration in the low impurity concentration layer being lower than an impurity concentration in the first semiconductor layer.