Memory devices and methods for managing error regions
Memory devices and methods are described that include a stack of memory dies and a logic die. Method and devices described include those that provide for repartitioning the stack of memory dies and storing the new partitions in a memory map. Repartitioning in selected configurations allows portions of memory to be removed from use without affecting the rest of the memory device. Additional devices, systems, and methods are disclosed.
1. A method, comprising:
forming a number of stacks of memory dies;
stacking a respective logic die with each of the stacks of memory dies;
collecting error data from a number of different memory portions within each stack of memory dies;
partitioning each stack of memory dies to remove from operation memory portions with error data that does not meet a standard; and
sorting the number of stacks of memory dies according to available bandwidth as determined by remaining memory capacity in each of the stacks of memory dies.
2. The method of claim 1 , wherein collecting error data from the number of different memory portions includes gathering locations of non-functioning memory portions.
3. The method of claim 1 , wherein collecting error data from the number of different memory portions includes gathering corresponding error rates in different memory portions.
4. The method of claim 1 , wherein partitioning each stack of memory dies to remove memory portions with error data that does not meet the standard includes partitioning each stack of memory dies to remove defective memory vaults in the stack of memory dies from operation.
5. The method of claim 1 , wherein partitioning each stack of memory dies to remove memory portions with error data that does not meet the standard includes partitioning each stack of memory dies to remove defective memory tiles in the stack of memory dies from operation.
6. The method of claim 1 , further including matching a stack of memory dies with a particular sorted memory bandwidth to a computing system that only requires the particular sorted memory bandwidth.
7. A method, comprising:
forming a stack of memory dies;
stacking a respective logic die with the stack of memory dies; and
forming a memory map to collect data from a number of different memory portions within each stack of memory dies, wherein the memory map is configured to repartition dynamically sized portions of the stack of memory dies in response to the data.
8. The method of claim 7 , wherein forming the memory map to collect data includes forming a memory map to collect error data.
9. The method of claim 7 , wherein forming the memory map to collect data includes forming a memory map to track errors that are correctable using an error correction code (ECC).
10. The method of claim 7 , wherein forming the memory map to collect data includes forming a memory map to collect error rate data and repartition the dynamically sized portions when the error rate data exceeds an error rate threshold.
11. The method of claim 7 , wherein forming the memory map includes forming a memory map that is configured to move data to another portion of the stack of memory dies if the errors are correctable using an error correction code (ECC).
12. A method, comprising:
forming a stack of memory dies;
stacking a respective logic die with the stack of memory dies;
collecting data from a number of different memory portions within the stack of memory dies; and
partitioning dynamically sized portions within the stack of memory dies as a function of data that does not meet a standard.
13. The method of claim 12 , wherein partitioning the stack of memory dies includes repartitioning portions of first memory vaults in the stack of memory dies below a defective through wafer interconnect (TWI) together into at least one second partition.
14. The method of claim 12 , wherein partitioning the stack of memory dies includes repartitioning portions of a number of partially defective first partitions together into at least one second partition.
15. The method of claim 12 , wherein partitioning the stack of memory dies includes partitioning a stack of memory dies to remove defective memory tiles in the stack of memory dies from operation.
16. The method of claim 12 , wherein collecting data from the number of different memory portions includes collecting data from a number of memory vaults in the stack of memory dies.
17. The method of claim 12 , further including forming a spare portion within the stack of memory dies.
18. The method of claim 17 , wherein forming the spare portion includes forming a spare memory vault.
19. The method of claim 17 , wherein forming the spare portion includes forming a spare memory die.