IP Library › Granted Patent US 8,638,178
Granted Patent B1
US 8,638,178 · App. 13/407,484 · Granted Jan 28, 2014

Methods of testing packaged thin-film piezoelectric-on-semiconductor microelectromechanical resonators having hermetic seals

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Quick Facts
Patent No.
US 8,638,178
App. No.
13/407,484
Granted
Jan 28, 2014
Kind
B1
Abstract

Methods of testing packaged thin-film piezoelectric-on-semiconductor (TPoS) microelectromechanical resonators having hermetic seals include measuring a quality factor (Q) of resonance of the packaged resonator at at least two unequal temperatures to determine whether a ΔQ/ΔT is significantly different (e.g, by at least 50%) over a temperature range (ΔT) spanning a smallest and largest of the at least two temperatures. These measurements are performed for a packaged resonator having a Q AIR <Q TED , where Q AIR is the quality factor of resonance of the packaged resonator due to air damping and Q TED is the quality factor of resonance of the packaged resonator due to thermoelastic damping.

Claims (5)

1. A method of testing a packaged thin-film piezoelectric-on-semiconductor microelectromechanical resonator, comprising:

measuring a quality factor of resonance (Q) of the packaged resonator at at least two unequal temperatures to determine a change in quality factor (EQ) over a temperature range (ΔT) spanning a smallest and largest of the at least two temperatures, for a packaged resonator having a Q AIR <Q TED , where Q AIR is the quality factor of resonance of the packaged resonator due to air damping and Q TED is the quality factor of resonance of the packaged resonator due to thermoelastic damping, said measuring comprising determining that the packaged resonator has a defective hermetic seal in the event a ΔQ/ΔT of the packaged resonator is at least 50% different than an otherwise equivalent packaged resonator having a hermetic seal.

2. The method of claim 1 , wherein said measuring comprises heating the packaged resonator from room temperature to a higher temperature.

3. The method of claim 1 , wherein the packaged resonator is configured so that Q air <(0.9)Q TED at the smallest and largest of the at least two temperatures.

4. The method of claim 1 , wherein the packaged resonator is configured so that Q air <(0.5)Q TED at the smallest of the at least two temperatures.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION; MAGNUM SEMICONDUCTOR, INC.
Reel/Frame 048746/0001 →
SECURITY AGREEMENT Recorded Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION; CHIPX, INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →