Semiconductor integrated circuit device including a fin-type field effect transistor and method of manufacturing the same
A semiconductor integrated circuit device, includes a first electrode including a first semiconductor layer formed on a substrate, a side surface insulating film formed on at least a part of a side surface of the first electrode, an upper surface insulating film formed on the first electrode and the side surface insulating film, a second electrode which covers the side surface insulating film and the upper surface insulating film, and a fin-type field effect transistor. The first electrode, the side surface insulating film, and the second electrode constitute a capacitor element. A thickness of the upper surface insulating film between the first electrode and the second electrode is larger than a thickness of the side surface insulating film between the first electrode and the second electrode, and the fin-type field effect transistor includes a second semiconductor layer which protrudes with respect to the plane of the substrate.
1. A semiconductor integrated circuit device, comprising:
a first electrode including a first semiconductor layer formed on a substrate;
a side surface insulating film formed on at least a part of a side surface of the first electrode;
an upper surface insulating film formed on the first electrode and the side surface insulating film;
a second electrode which covers the side surface insulating film and the upper surface insulating film;
a fin-type field effect transistor; and
a capacitor element includes the first electrode, the side surface insulating film, and the second electrode, wherein:
a thickness of the upper surface insulating film between the first electrode and the second electrode is larger than a thickness of the side surface insulating film between the first electrode and the second electrode; and
the fin-type field effect transistor comprises:
a second semiconductor layer which protrudes with respect to the plane of the substrate;
a channel region;
a source region, region;
a drain region;
a gate insulating film formed on the channel region; and
a gate electrode formed on the gate insulating film.
2. A semiconductor integrated circuit device, comprising:
a substrate;
a semiconductor layer formed on the substrate;
an insulating layer formed on the semiconductor layer;
an electrode layer formed on the insulating layer;
a fin-type field effect transistor portion comprising:
at least a part of the semiconductor layer;
the insulating layer;
the electrode layer; and
a channel region, a source region, and a drain region, which are formed as the semiconductor layer, a gate insulating film formed as the insulating layer, and a gate electrode formed as the electrode layer; and
a capacitor element portion comprising:
at least another part of the semiconductor layer;
the insulating layer;
the electrode layer; and
a first electrode formed as the semiconductor layer, an insulating film formed as the insulating layer, and a second electrode formed as the electrode layer, wherein
a thickness of the insulating film on an upper surface of the first electrode of the capacitor element portion in a direction perpendicular to a plane of the substrate is larger than a thickness of the insulating film on a side surface of the first electrode of the capacitor element portion in a direction parallel to the plane of the substrate.
3. A semiconductor integrated circuit device according to claim 2 , wherein a capacitance of a part of the capacitor element portion which is formed on the upper surface of the first electrode is smaller than a capacitance of another part of the capacitor element portion which is formed on the side surface of the first electrode.
4. A semiconductor integrated circuit device according to claim 2 , wherein an area of a surface of the capacitor element portion which extends in the direction parallel to the substrate on the upper surface of the first electrode is smaller than an area of another surface of the capacitor element portion which extends in the direction perpendicular to the substrate on the side surface of the first electrode.
5. A semiconductor integrated circuit device according to claim 2 , wherein, when the substrate is seen from above, an area occupied by the fin-type field effect transistor portion is larger than an area occupied by the capacitor element portion.
6. A semiconductor integrated circuit device according to claim 2 , wherein the fin-type field effect transistor portion and the capacitor element portion are formed in the semiconductor layer which forms a protrusion.
7. A semiconductor integrated circuit device according to claim 1 , wherein the source region of the fin-type field, effect transistor comprises an n-type region and the channel region of the fin-type field effect transistor comprises a p-type region.
8. A semiconductor integrated circuit device according to claim 1 , wherein the source region of the fin-type field effect transistor comprises a p-type region and the channel region of the fin-type field effect transistor comprises an n-type region.
9. A semiconductor integrated circuit device according to claim 1 , wherein a conductivity type of the first electrode is different than a conductivity type of the second electrode.
10. A semiconductor integrated circuit device according to claim 1 , wherein the upper surface insulating film includes a plurality of laminated insulating films.