Bipolar junction transistors and memory arrays
View Patent ↗Some embodiments include methods of forming BJTs. A first type doped region is formed within semiconductor material. First and second trenches are formed within the semiconductor material to pattern an array of pedestals, and the trenches are filled with electrically insulative material. An upper portion of the first type doped region is counter-doped to form a first stack having a second type doped region over a first type doped region, and an upper portion of the first stack is then counter-doped to form a second stack having a second type doped region between a pair of first type doped regions. Some embodiments include a BJT array. A base implant region is between a pair of emitter/collector implant regions. Electrically insulative material is adjacent the base implant region, and contains at least about 7×10 16 atoms/cm 3 of base implant region dopant.
1. An array of bipolar junction transistors, comprising:
a stack of implant regions within a semiconductor material; the stack comprising a base implant region between a pair of emitter/collector implant regions; one of the emitter/collector implant regions being a top emitter/collector region and the other of the emitter/collector implant regions being a bottom emitter/collector region; the emitter/collector implant regions being a first type and the base implant region being a second type, with one of the first and second types being p-type and the other being n-type; the base implant region, together with the emitter/collector implant regions, comprising the bipolar junction transistors;
first trenches extending along a first direction within the stack; and second trenches extending along a second direction within the stack; the first trenches penetrating only partially through the base implant region, and the second trenches penetrating entirely through the base implant region but only partially through the bottom emitter/collector region; the second direction intersecting the first direction; and
electrically insulative material within the first and second trenches; wherein at least some of the electrically insulative material within the first and second trenches comprises at least about 7×10 16 atoms/cm 3 of second type dopant.
2. The array of claim 1 wherein the second type dopant is substantially uniformly distributed within the first and second trenches to about a common depth as the base implant region within the stack.
3. The array of claim 1 wherein at least a portion of said at least some of the electrically insulative material comprises at least about 1×10 19 atoms/cm 3 of first type dopant.
4. The array of claim 1 wherein said at least some of the electrically insulative material within the first and second trenches comprises from about 7×10 16 atoms/cm 3 of second type dopant to about 7×10 18 atoms/cm 3 of second type dopant.
5. The array of claim 1 wherein the electrically insulative material comprises one or both of silicon dioxide and silicon nitride.
6. The array of claim 1 wherein the electrically insulative material consists of silicon dioxide.
7. A memory array, comprising:
a stack of implant regions within a semiconductor material; the stack comprising, in ascending order, a bottom emitter/collector implant region, a base implant region, and a top emitter/collector implant region; the emitter/collector implant regions being a first type and the base implant region being a second type, with one of the first and second types being p-type and the other being n-type; the base implant region, together with the emitter/collector implant regions, comprising bipolar junction transistors;
first trenches extending along a first direction within the stack; and second trenches extending along a second direction within the stack; the first trenches penetrating only partially through the base implant region, and the second trenches penetrating entirely through the base implant region but only partially through the bottom emitter/collector region; the second direction intersecting the first direction;
first type reinforcement doping at the bottoms of the second trenches, and second type reinforcement doping at the bottoms of the first trenches;
electrically insulative material within the first and second trenches; at least some of the electrically insulative material comprising at least about 7×10 16 atoms/cm 3 of second type dopant; and
memory cells over and electrically connected with the top emitter/collector implant region.
8. The array of claim 7 wherein the second type dopant is substantially uniformly distributed within the first and second trenches to about a common depth as the base implant region within the semiconductor material.
9. The array of claim 7 wherein at least a portion of said at least some of the electrically insulative material comprises at least about 1×10 19 atoms/cm 3 of first type dopant.
10. The array of claim 7 wherein said at least some of the electrically insulative material within the first and second trenches comprises from about 7×10 16 atoms/cm 3 of second type dopant to about 7×10 18 atoms/cm 3 of second type dopant.
11. The memory array of claim 7 further comprising base contact regions which extend through the top emitter/collector implant region to connect with the base implant region.
12. The memory array of claim 7 wherein the memory cells are RRAM cells.
13. The memory array of claim 7 wherein the memory cells are phase change memory cells.
14. The memory array of claim 7 wherein the electrically insulative material comprises one or both of silicon dioxide and silicon nitride.
15. The memory array of claim 7 wherein the electrically insulative material consists of silicon dioxide.
16. The array of claim 1 wherein the base implant region is n-type.
17. The memory array of claim 7 wherein the base implant region is n-type.