Method for fabricating stacked nitride-compound semiconductor structure and method for fabricating nitride-compound semiconductor light emitting device

1. A method for fabricating a stacked nitride-compound semiconductor structure, comprising:

forming a first protection film on a second surface of a substrate, the substrate having a first thermal expansion coefficient, the second surface being opposed to a first surface of the substrate;

forming a first nitride-compound semiconductor layer on the first surface of the substrate, the first nitride-compound semiconductor layer having a second thermal expansion coefficient which is different from the first thermal expansion coefficient;

forming a second protection film on the first nitride-compound semiconductor layer, the second protection film and first protection film being a same material;

covering a surface and side surfaces of the second protection film with a third protection film, then using a chemical solution to remove the first protection film to expose the second surface of the substrate;

forming a second nitride-compound semiconductor layer on the second surface of the substrate exposed by removing the first protection film, the second nitride-compound semiconductor layer having a third thermal expansion coefficient which is approximately equal to the second thermal expansion coefficient; and

removing the second protection film to expose the first nitride-compound semiconductor layer.

2. The method of claim 1 , wherein

a first deposition substance is formed on the first protection film in forming the first nitride-compound semiconductor layer and the first deposition substance is simultaneously removed with the first protection film in removing the first protection film.

3. The method of claim 1 , wherein

a second deposition substance is formed on the second protection film in forming the second nitride-compound semiconductor layer and the second deposition substance is simultaneously removed with the second protection film in removing the second protection film.

4. The method of claim 1 , wherein

removing the first protection film and the second protection film are performed by isotropic etching.

5. The method of claim 1 , wherein

both the first protection film and the second protection film are composed of silicon oxide.

6. The method of claim 1 , wherein

the substrate is composed of at least one material selected from silicon, sapphire, silicon carbide and zinc oxide.

7. The method of claim 1 , wherein

the second nitride-compound semiconductor layer comprises a GaN layer, a first GaN clad layer, a multiple quantum well (MQW) layer, a second GaN clad layer, and a GaN contact layer stacked in order.

8. The method of claim 7 , wherein

the MQW layer comprises a plurality of a GaN barrier layers and a plurality of InGaN quantum well layers provided in alternation with the plurality of GaN barrier layers, and the uppermost layer of the MQW layer is an InGaN quantum well layer.

9. A method for fabricating a stacked nitride-compound semiconductor structure, comprising:

forming a first protection film on a second surface of a substrate, the substrate having a first thermal expansion coefficient, the second surface being opposed to a first surface of the substrate;

forming a first nitride-compound semiconductor layer on the first surface of the substrate, the first nitride-compound semiconductor layer having a second thermal expansion coefficient which is different from the first thermal expansion coefficient;

forming a second protection film on the first nitride-compound semiconductor layer, the second protection film and the first protection film being different materials;

removing the first protection film to expose the second surface of the substrate using a chemical solution having a selectivity for the first protection film over the second protection film;

forming a second nitride-compound semiconductor layer on the second surface of the substrate exposed by removing the first protection film, the second nitride-compound semiconductor layer having a third thermal expansion coefficient which is approximately equal to the second thermal expansion coefficient; and

removing the second protection film to expose the first nitride-compound semiconductor layer.

10. The method of claim 9 , wherein

the first protection film is composed of silicon oxide and the second protection film is composed of silicon nitride.

11. The method of claim 9 , wherein

a first deposition substance is formed on the first protection film in forming the first nitride-compound semiconductor layer and the first deposition substance is simultaneously removed with the first protection film in removing the first protection film.

12. The method of claim 9 , wherein

a second deposition substance is formed on the second protection film in forming the second nitride-compound semiconductor layer and the second deposition substance is simultaneously removed with the second protection film in removing the second protection film.

13. The method of claim 9 , wherein

removing the first protection film and the second protection film are performed by isotropic etching.

14. The method of claim 9 , wherein

the substrate is composed of at least one material selected from silicon, sapphire, silicon carbide and zinc oxide.

15. The method of claim 9 , wherein

the second nitride-compound semiconductor layer comprises a GaN layer, a first GaN clad layer, a multiple quantum well (MQW) layer, a second GaN clad layer and a GaN contact layer stacked in order.

16. The method of claim 15 , wherein

the MQW layer comprises a plurality of GaN barrier layers and a plurality of InGaN quantum well layers provided in alternation with the plurality of GaN barrier layers, and the uppermost layer of the MQW layer is an InGaN quantum well layer.

17. A method for fabricating a nitride-compound light emitting semiconductor device, comprising:

forming a first protection film on a second surface of a substrate, the substrate having a first thermal expansion coefficient, the second surface being opposed to a first surface of the substrate;

forming a first nitride-compound semiconductor layer on the first surface of the substrate, the first nitride-compound semiconductor layer having a second thermal expansion coefficient which is different from the first thermal expansion coefficient;

forming a second protection film on the first nitride-compound semiconductor layer, the second protection film and the first protection film being a same material;

covering a surface and side surfaces of the second protection film with a third protection film, then using a chemical solution to remove the first protection film to expose the second surface of the substrate;

forming a second nitride-compound semiconductor layer comprising a GaN layer, a first GaN clad layer, a multiple quantum well (MQW) layer, a second GaN clad layer, and a GaN contact layer respectively stacked in order on the second surface of the substrate exposed by removing the first protection film, the second nitride-compound semiconductor layer having a third thermal expansion coefficient which is approximately equal to the second thermal expansion coefficient;

removing the second protection film to expose the first nitride-compound semiconductor layer;

removing a portion of the second nitride-compound semiconductor layer, the portion extending from the GaN contact layer to the MQW layer, to expose a surface of the first GaN clad layer;

forming a first electrode on the GaN contact layer; and

forming a second electrode on the first clad layer.

18. The method of claim 17 , wherein

a first deposition substance is formed on the first protection film in forming the first nitride-compound semiconductor layer and the first deposition substance is simultaneously removed with the first protection film in removing the first protection film.

19. The method of claim 17 , wherein

a second deposition substance is formed on the second protection film in forming the second nitride-compound semiconductor layer and the second deposition substance is simultaneously removed with the second protection film in removing the second protection film.