Silicon carbide semiconductor device
An SiC semiconductor device includes a semiconductor element formed in an SiC substrate, a source electrode and a gate pad formed by using an interconnect layer having barrier metal provided at the bottom surface thereof, and a temperature measuring resistive element formed by using part of the barrier metal in the interconnect line.
1. A silicon carbide semiconductor device, comprising:
a semiconductor element formed in a silicon carbide substrate;
an interconnect layer formed on said silicon carbide substrate and having barrier metal provided at the bottom surface thereof; and
a temperature measuring resistive element formed by using part of said barrier metal in said interconnect layer.
2. The silicon carbide semiconductor device according to claim 1 , wherein said temperature measuring resistive element is arranged in a central portion of a chip of said silicon carbide semiconductor device as viewed in plan view.
3. The silicon carbide semiconductor device according to claim 1 , wherein said temperature measuring resistive element is arranged in a region on an outer circumferential portion of a chip of said silicon carbide semiconductor device as viewed in plan view, the region being a region where no current flows.
4. The silicon carbide semiconductor device according to claim 1 , wherein said temperature measuring resistive element is arranged to surround an active region in which said semiconductor element is formed as viewed in plan view.
5. The silicon carbide semiconductor device according to claim 4 , wherein said temperature measuring resistive element is arranged in a termination region on the outer side of said semiconductor element, said temperature measuring resistive element functioning as a field plate.
6. The silicon carbide semiconductor device according to claim 1 , wherein a pad for taking an output voltage out of said temperature measuring resistive element is formed by using said interconnect layer.
7. The silicon carbide semiconductor device according to claim 1 , wherein said barrier metal is any one of a Ti film, a TiN film, a TiSi film, a TiSi/TiN film, a TiSi/Ti film, a TiN/Ti film, a TiSi/TiN/Ti film, and a Pt film.