IP Library Granted Patent US 9,102,035
Granted Patent B2
US 9,102,035 · App. 13/417,792 · Granted Aug 11, 2015

Method for machining seed rods for use in a chemical vapor deposition polysilicon reactor

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Quick Facts
Patent No.
US 9,102,035
App. No.
13/417,792
Granted
Aug 11, 2015
Kind
B2
Abstract

A method for machining a profile into a silicon seed rod using a machine. The silicon seed rod is capable of being used in a chemical vapor deposition polysilicon reactor. The machine includes a plurality of grinding wheels. The method includes grinding a v-shaped profile into a first end of the silicon seed rod with one of the plurality of grinding wheels and grinding a conical profile in a second end of the silicon seed rod with another of the plurality of grinding wheels.

Claims (16)

1. A method for machining a profile into a silicon seed rod using a machine, the silicon seed rod used in a chemical vapor deposition polysilicon reactor, the machine comprising a plurality of grinding wheels, the method comprising:

providing a silicon seed rod having a first end and an opposing second end;

grinding a v-shaped profile into an end face of the first end of the silicon seed rod with one of the plurality of grinding wheels; and

grinding a conical profile in the second end of the silicon seed rod with another of the plurality of grinding wheels.

2. The method of claim 1 wherein a rate of the grinding of the conical profile in the second end is controlled based at least in part on an output of an optical measurement system.

3. The method of claim 2 wherein the optical measurement system measures an angle of the conical profile and outputs the measurement to the system.

4. The method of claim 1 wherein at least a portion of the second end is shaped to be received within a chuck of the reactor.

5. The method of claim 1 further comprising loading a seed rod into the machine.

6. The method of claim 5 wherein the seed rod is moved by a conveyance system so that the first end comes into contact with one of the plurality of grinding wheels.

7. The method of claim 6 wherein the seed rod is moved by the conveyance system so that the second end comes into contact with another of the plurality of grinding wheels.

8. The method of claim 1 wherein the silicon seed rod is one of a plurality of silicon seed rods, the method further comprising loading the plurality of seeds rods into the machine, and moving one of the plurality of seed rods using a conveyance system such that a first end of the silicon seed rod comes into contact with one of the plurality of grinding wheels.

9. The method of claim 1 further comprising measuring at least one of the v-shaped profile and the conical profile with an optical measurement system, and rejecting the silicon seed rod based at least in part on an output of the optical measurement system.

10. The method of claim 1 wherein the v-shaped profile forms a channel configured to receive a bridge rod.

11. The method of claim 1 wherein the silicon seed rod has a length of between about 2,000 millimeters (mm) and about 3,000 mm.

12. The method of claim 1 wherein the silicon seed rod has a cross-sectional area of between about 70 mm 2 and about 90 mm 2 .

13. The method of claim 1 wherein the silicon seed rod has a square-shaped cross-section.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 18, 2012
From: BOVO, RODOLFO; MOLINO, PAOLO
To: MEMC ELECTRONIC MATERIALS, SPA
Reel/Frame 028063/0619 →