Light emitting diode package and method for manufacturing the same

1. A light emitting diode package, comprising:

a first substrate comprising sapphire;

semiconductor structure layers disposed on a first surface of the first substrate, each semiconductor structure layer comprising a first type semiconductor layer, an active layer, and a second type semiconductor layer;

a first bump disposed on and electrically connected to a first semiconductor structure layer and a second bump disposed on and electrically connected to a second semiconductor structure layer;

a protective layer disposed on the first and second bumps, disposed on portions of the semiconductor structure layers, and disposed directly on a laterally inclined side surface of the first substrate; and

a first contact part and a second contact part disposed on the protective layer and electrically connected to the first bump and the second bump, respectively.

2. The light emitting diode package of claim 1 , further comprising first and second insulating layers disposed between the semiconductor structure layers and the protective layer.

3. The light emitting diode package of claim 2 , further comprising first and second connection wirings disposed between the first and second insulating layers on the first semiconductor structure layer.

4. The light emitting diode package of claim 3 , wherein the first insulating layer comprises a first opening exposing a portion of the first type semiconductor layer and a second opening exposing a portion of the second type semiconductor layer.

5. The light emitting diode package of claim 4 , wherein:

the first connection wiring contacts the first type semiconductor layer through the first opening; and

the second connection wiring contacts the second type semiconductor layer through the second opening.

6. The light emitting diode package of claim 5 , wherein:

the first connection wiring connects the first semiconductor layer of the first semiconductor structure layer and the first bump; and

the second connection wiring connects the second semiconductor layer of the second semiconductor structure layer and the second bump.

7. The light emitting diode package of claim 1 , wherein the protective layer covers first portions of the first bump and the second bump.

8. The light emitting diode package of claim 7 , wherein the protective layer exposes second portions of the first bump and the second bump.

9. The light emitting diode package of claim 8 , wherein the first contact part contacts the second portion of the first bump and the second contact part contacts the second portion of second bump.

10. The light emitting diode package of claim 1 , further comprising:

a second substrate;

a first electrode and a second electrode disposed on a surface of the second substrate, the first electrode and the second electrode corresponding to the first contact part and the second contact part, respectively; and

a conductive adhesive material electrically connecting the first contact part and the second contact part to the first electrode and the second electrode, respectively.

11. The light emitting diode package of claim 10 , wherein the conductive adhesive material covers at least a part of the semiconductor structures.

12. The light emitting diode package of claim 11 , wherein:

the conductive adhesive material covers at least a part of the protective layer; and

the protective layer is disposed between the conductive adhesive material and the semiconductor structure layers.

13. The light emitting diode package of claim 10 , wherein the conductive adhesive material covers at least a part of the first substrate.

14. The light emitting diode package of claim 10 , wherein the conductive adhesive material is at least one selected from the group consisting of Cr, Ni, Ti, Au, and Sn.