CAMERA MODULE
Disclosed herein is a camera module including: a lens barrel part in which a plurality of lenses are stacked; a housing enclosing an outer peripheral surface of the lens barrel part; an infrared (IR)-cut filter mounted at a lower portion of the housing to remove a near infrared wavelength; an image sensor mounted on a lower portion of the IR-cut filter to convert an external image into an electrical signal; a circuit board having an opening part formed at the center thereof, the opening part receiving the image sensor therein; and a plate mounted on the circuit board and made of a thermal conductive material so as to radiate heat generated from the circuit board.
1 . A camera module comprising:
a lens barrel part in which a plurality of lenses are stacked;
a housing enclosing an outer peripheral surface of the lens barrel part;
an infrared (IR)-cut filter mounted at a lower portion of the housing to remove a near infrared wavelength;
an image sensor mounted on a lower portion of the IR-cut filter to convert an external image into an electrical signal;
a circuit board having an opening part formed at the center thereof, the opening part receiving the image sensor therein; and
a plate mounted on the circuit board to radiate heat generated from the circuit board.
2 . The camera module as set forth in claim 1 , wherein the circuit board has a thickness corresponding to that of the image sensor.
3 . The camera module as set forth in claim 1 , further comprising a wire bonding part electrically connecting the image sensor and the circuit board to each other.
4 . The camera module as set forth in claim 1 , wherein the plate has a thickness thinner than that of the circuit board.
5 . The camera module as set forth in claim 1 , wherein the plate is made of a steel or copper material.
6 . The camera module as set forth in claim 1 , wherein the plate is made of a thermal conductive material.