Method of room temperature covalent bonding
View Patent ↗A method of bonding includes using a bonding layer having a fluorinated oxide. Fluorine may be introduced into the bonding layer by exposure to a fluorine-containing solution, vapor or gas or by implantation. The bonding layer may also be formed using a method where fluorine is introduced into the layer during its formation. The surface of the bonding layer is terminated with a desired species, preferably an NH 2 species. This may be accomplished by exposing the bonding layer to an NH 4 OH solution. High bonding strength is obtained at room temperature. The method may also include bonding two bonding layers together and creating a fluorine distribution having a peak in the vicinity of the interface between the bonding layers. One of the bonding layers may include two oxide layers formed on each other. The fluorine concentration may also have a second peak at the interface between the two oxide layers.
1. A bonded structure, comprising:
a first oxide layer containing fluorine disposed on a substrate which has been heated prior to being bonded to a second oxide layer;
an SiOF surface layer formed in the first oxide layer before being bonded to the second oxide layer;
a surface of the first oxide layer terminated with a species;
the terminated first oxide layer bonded in direct contact with the second oxide layer; and
Si—N covalent bonds formed at an interface between the first and second oxide layers.
2. A structure as recited in claim 1 , comprising:
a bond strength formed between the first and second oxide layers of at least 500 mJ/m 2 .
3. A structure as recited in claim 1 , comprising:
a bond strength formed between the first and second oxide layers of at least 1000 mJ/m 2 .
4. A structure as recited in claim 1 , comprising:
a bond strength formed between the first and second oxide layers of at least 2500 mJ/m 2 .
5. A structure as recited in claim 1 , comprising:
at least one surface of said first and second oxide layers being activated.
6. A structure as recited in claim 5 , comprising:
the surface of the first oxide layer being activated and terminated at the same time.
7. A structure as recited in claim 1 , wherein said first oxide layer comprises an oxide layer exposed to a fluorine-containing solution.
8. A structure as recited in claim 1 , comprising:
said first oxide layer heated to a temperature in a range of about 100-300° C.
9. A structure as recited in claim 1 , wherein at least one of said first and second oxide layers comprises an etched oxide layer.
10. A structure as recited in claim 1 , wherein at least one of said first and second oxide layers comprises a polished oxide layer.
11. A bonded structure, comprising:
a first oxide layer disposed on a first element and etched using fluorine;
a second oxide layer formed over the first oxide layer and having a chemically-mechanically polished surface;
the surface of the second oxide layer being terminated;
the first oxide layer being heated prior to being bonded to a second element;
an SiOF surface layer formed in the first oxide layer prior to being bonded to the second element;
the second oxide layer bonded to the second element; and
Si—N covalent bonds formed at an interface between the first and second oxide layers.
12. A structure as recited in claim 11 , comprising:
a bond strength formed between the second oxide layer and second element of at least 500 mJ/m 2 .
13. A structure as recited in claim 11 , comprising:
a bond strength formed between the second oxide layer and the second element of at least 1000 mJ/m 2 .
14. A structure as recited in claim 11 , comprising:
a bond strength formed between the second oxide layer and the second element of at least 2500 mJ/m 2 .
15. A structure as recited in claim 11 , comprising:
the surface of the second oxide layer being activated.
16. A structure as recited in claim 15 , wherein the surface of the second oxide layer is activated and terminated.
17. A structure as recited in claim 11 , comprising:
the second oxide layer being terminated with a nitrogen-containing species.
18. A structure as recited in claim 11 , wherein the first oxide layer is heated in a range of 100-300° C. before the bonding.