Compliant off-chip interconnects for use in electronic packages and fabrication methods
Disclosed are apparatus comprising single-path and multiple-path compliant interconnects that are coupled between electrical contacts and that allow for increased electrical performance without compromising mechanical reliability. Exemplary apparatus comprises a conductive vertical anchor coupled at a first end to an electrical contact; and one or more conductive arcuate beams coupled at a first end to a second end of the vertical anchor, and coupled at a second end to a second electrical contact. One electrical contact comprises a die contact pad and the other electrical contact comprises a substrate contact pad. Alternatively, one electrical contact comprises a substrate contact pad and the other electrical contact comprises a printed circuit board contact pad. Also, one electrical contact comprises a die contact pad and the other electrical contact comprises a printed circuit board contact pad. Methods of fabricating the apparatus are also disclosed.
1. A method comprising:
providing a panel having electrically conductive contacts formed thereon;
forming a passivation layer on the panel and electrically conductive contacts;
forming a first mold on the panel above the electrically conductive contacts that simultaneously creates an opening in the passivation layer and defines an anchor of an interconnect;
forming a second mold above the first mold that defines one or more arcuate beam structures; and
forming an electrically conductive compliant interconnect comprising the anchor and the one or more arcuate beam structures using the first and second molds.
2. The method recited in claim 1 , further comprising:
removing the first and second molds.
3. The method recited in claim 1 , wherein the panel comprises multiple die, multiple substrates, multiple printed circuit boards, or combinations thereof.
4. The method recited in claim 1 , further comprising:
forming a third mold above the electrically conductive compliant interconnect; and
forming an electrically conductive interconnect extension using the third mold that is coupled to the electrically conductive compliant interconnect.
5. The method recited in claim 4 , further comprising:
removing the first, second and third molds.
6. The method recited in claim 4 , wherein the panel comprises multiple die, multiple substrates, multiple printed circuit boards, or combinations thereof.
7. The method recited in claim 1 wherein forming the first mold comprises:
depositing a first photoresist layer on the passivation layer;
forming an opening in the first photoresist layer to create an opening in the passivation layer and define the first mold; and
forming a vertical anchor for the interconnect.
8. The method recited in claim 1 , wherein forming the second mold comprises:
depositing a seed layer on the first photoresist layer;
depositing a second photoresist layer on the seed layer to define the second mold; and
forming the one or more arcuate beam structures.
9. The method recited in claim 8 , further comprising:
removing the first and second molds.
10. The method recited in claim 8 , wherein forming the third mold comprises:
depositing a third photoresist layer on the second photoresist layer and the electrically conductive compliant interconnect; and
forming an opening in the third photoresist layer to define the electrically conductive interconnect extension; and
forming the electrically conductive interconnect extension.
11. The method recited in claim 10 , further comprising:
removing the first, second and third molds.