IP Library › Granted Patent US 8,975,527
Granted Patent B2
US 8,975,527 · App. 13/437,033 · Granted Mar 10, 2015

Circuit board

Inventor: Hidekiyo Takaoka (Nagaokakyo, JP)
Assignee: Murata Manufacturing Co., Ltd.
H05K1/028H05K3/4691H05K3/4614H05K3/4632H05K2201/09036
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Quick Facts
Patent No.
US 8,975,527
App. No.
13/437,033
Granted
Mar 10, 2015
Kind
B2
Abstract

A circuit board prevents breakage at a boundary between a rigid region and a flexible region and includes a body including stacked flexible sheets, and rigid regions and a flexible region more flexible than the rigid regions. A circuit is defined by a conductor provided in the body. In the flexible region on a principal surface of the body, grooves are arranged to be in contact with boundaries between the flexible region and the rigid regions and to extend along the boundaries.

Claims (11)

1. A circuit board comprising:

a body including a plurality of stacked insulating layers and a first region and a second region more flexible than the first region; and

a circuit defined by a conductor provided in the body; wherein

in the second region on a first principal surface of the body, a first groove is arranged to be in contact with a boundary between the first region and the second region and to extend along the boundary;

in the second region on a second principal surface of the body opposite to the first principal surface of the body, a second groove is arranged to be in contact with the boundary between the first region and the second region and to extend along the boundary; and

no grooves are provided in a central portion of the second region on the first principal surface or on the second principal surface of the body.

2. The circuit board according to claim 1 , wherein a number of the insulating layers in the first region is larger than a number of the insulating layers in the second region, and a stepped portion is provided at the boundary between the first region and the second region.

3. The circuit board according to claim 1 , wherein at least one third groove parallel or substantially parallel to the first groove is provided in the second region on the first principal surface of the body.

4. The circuit board according to claim 3 , wherein the at least one third groove includes a plurality of third grooves, the first groove is deeper than the plurality of third grooves, and the plurality of third grooves decrease in depth extending away from the boundary.

5. The circuit board according to claim 1 , wherein all of the plurality of insulating layers included in the body are flexible.

6. The circuit board according to claim 1 , wherein, in plan view in a layer stacking direction, a ratio of an area occupied by the conductor in the first region is higher than a ratio of an area occupied by the conductor in the second region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2012
From: TAKAOKA, HIDEKIYO
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 027969/0755 →
Priority Claims (1)
JP 2009-231425 · Oct 5, 2009 · national
Continuity (2)
Continuation PCTJP2010067415 · Oct 5, 2010
Related Publication 20120186860A1 · Jul 26, 2012