Method for forming and stabilizing printed conductors on a flexible substrate
View Patent ↗A method for forming printed conductors on a flexible substrate is disclosed. Initially, an inorganic matrix precursor is printed onto a flexible substrate. The inorganic precursor is then cured with a light pulse to form a porous inorganic matrix thin film. A polymer is subsequently infused into the porous inorganic matrix thin film to form a polymer infused inorganic matrix thin film.
1. A method for forming printed conductors on a flexible substrate, said method comprising:
printing an inorganic matrix precursor onto a flexible substrate;
curing said inorganic precursor with a light pulse to form a porous inorganic matrix thin film; and
infusing a polymer into said porous inorganic matrix thin film to form a polymer infused inorganic matrix thin film.
2. The method of claim 1 , wherein said infusing further includes infusing a solvent-applied polymer.
3. The method of claim 1 , wherein said infusing further includes infusing a low-melt flow rate polymer.
4. The method of claim 1 , wherein said infusing further includes infusing a UV-curable polymer.
5. The method of claim 1 , wherein said inorganic matrix thin film is a metal.
6. The method of claim 1 , wherein said inorganic matrix thin film is copper.
7. The method of claim 1 , wherein said inorganic matrix thin film is electrically conductive.
8. The method of claim 1 , wherein a contact resistance of said polymer infused inorganic matrix thin film is less than 0.5 Ω.
9. A method for forming printed conductors on a flexible substrate, said method comprising:
forming a porous inorganic matrix thin film onto a flexible substrate; and
infusing a polymer into said porous inorganic matrix thin film to form a polymer infused inorganic matrix thin film.
10. The method of claim 9 , wherein said infusing further includes infusing a solvent-applied polymer.
11. The method of claim 9 , wherein said infusing further includes infusing a low-melt flow rate polymer.
12. The method of claim 9 , wherein said infusing further includes infusing a UV-curable polymer.
13. The method of claim 9 , wherein said inorganic matrix thin film is a metal.
14. The method of claim 9 , wherein said inorganic matrix thin film is copper.
15. The method of claim 9 , wherein said inorganic matrix thin film is electrically conductive.
16. The method of claim 9 , wherein a contact resistance of said polymer infused inorganic matrix thin film is less than 0.5 Ω.