Patent Assignment
Reel/Frame 071520/0873
Nunc Pro Tunc Assignment
Recorded: 2025-06-05
Pages: 14
Assignor
NCC NANO, LLC
Executed: 2025-06-04
Assignee
PULSEFORGE, INC.
400 PARKER DRIVE, SUITE 1100, AUSTIN, TEXAS, 78728
Covered Properties
(49)
Method for Forming and Stabilizing Printed Conductors on a Flexible Substrate
PCT:
PCT/US2012/034679 ↗
Method for Forming Thin Film Conductors on a Substrate
PCT:
PCT/US2012/067607 ↗
Method for Connecting Surface-Mount Electronic Components to a Circuit Board
PCT:
PCT/US2020/037551 ↗
Method for Attaching and Detaching Substrates During Integrated Circuit Manufacturing
PCT:
PCT/US2021/025184 ↗
Method and Apparatus for Debonding Temporarily Bonded Wafers in Wafer-Level Packaging Applications
PCT:
PCT/US2021/062883 ↗
Method and Apparatus for Removing Particles from the Surface of a Semiconductor Wafer
PCT:
PCT/US2021/062897 ↗
Method and Apparatus for Removing Particles from the Surface of a Semiconductor Wafer
PCT:
PCT/US2021/062901 ↗
Method and Apparatus for Removing Particles from the Surface of a Semiconductor Wafer
PCT:
PCT/US2021/062905 ↗
Electrical, Plating and Catalytic Uses of Metal Nanomaterial Compositions
Method and Apparatus for Curing Thin Films on Low-Temperature Substrates at High Speeds
Method for Reducing Thin Films on Low Temperature Substrates
Method and Apparatus for Reacting Thin Films on Low-Temperature Substrates at High Speeds
Application:
12/581,606 →
Publication:
US 2010/0098874
Light Curing Apparatus Having a Modular Lamp Housing
Electrical Plating and Catalytic Uses of Metal Nanomaterial Compositions
Apparatus for Curing Thin Films on a Moving Substrate
Application:
13/081,561 →
Publication:
US 2011/0247851
Apparatus for Providing Transient Thermal Profile Processing on a Moving Substrate
Method for Providing Lateral Thermal Processing of Thin Films on Low-Temperature Substrates
Method for Drying Thin Films in an Energy Efficient Manner
Method for Forming and Stabilizing Printed Conductors on a Flexible Substrate
Method for Depositing and Curing Nanoparticle-Based Ink
Method for Forming Thin Film Conductors on a Substrate
Method and Apparatus for Curing Thin Films on Low-Temperature Substrates at High Speeds
Method for Providing Lateral Thermal Processing of Thin Films on Low-Temperature Substrates
Method and Apparatus for Curing Thin Films on Low-Temperature Substrates at High Speeds
Substrate for Printed Electronics and Photonic Curing Process
Apparatus for Providing Transient Thermal Profile Processing on a Moving Substrate
Method for Reducing Thin Films on Low Temperature Substrates
Method for Providing Lateral Thermal Processing of Thin Films on Low-Temperature Substrates
Method and Apparatus for Curing Thin Films on Low-Temperature Substrates at High Speeds
Method for Depositing a Functional Material on a Substrate
Method for Performing Delamination of a Polymer Film
Electrical, Plating and Catalytic Uses of Metal Nanomaterial Compositions
Method for Deposting a Functional Material on a Substrate
Application:
15/387,297 →
Publication:
US 2018/0171468
Method and Apparatus for Curing Thin Films on Low-Temperature Substrates at High Speeds
Method for Deposting a Functional Material on a Substrate
Apparatus for Curing Thin Films on a Moving Substrate
Method for Reducing Thin Films on Low Temperature Substrates
Method for Curing Solder Paste on a Thermally Fragile Substrate
Method for Performing Delamination of a Polymer Film
Method for Reducing Thin Films on Low Temperature Substrates
Method for Connecting Surface-Mount Electronic Components to a Circuit Board
Method for Curing Solder Paste on a Thermally Fragile Substrate
Method and Apparatus for Debonding Temporarily Bonded Wafers in Wafer-Level Packaging Applications
Method for Attaching and Detaching Substrates During Integrated Circuit Manufacturing
Patent:
11,358,381 →
Application:
17/219,199 →
Method and Apparatus for Removing Particles from the Surface of a Semiconductor Wafer
Method and Apparatus for Removing Particles from the Surface of a Semiconductor Wafer
Method and Apparatus for Removing Particles from the Surface of a Semiconductor Wafer
Patent:
11,621,175 →
Application:
17/541,953 →
Method and Apparatus for Debonding Temporarily Bonded Wafers in Wafer-Level Packaging Applications
Method and Apparatus for Debonding Temporarily Bonded Wafers in Wafer-Level Packaging Applications
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 5, 2009
From: SCHRODER, KURT A.; MARTIN, KARL M.; JACKSON, DOUG K.; MCCOOL, STEVEN C.
To: NCC NANO, LLC
Reel/Frame 022213/0623 →
Assignment of Assignor's Interest
Apr 6, 2009
From: POPE, DAVE S.; SCHRODER, KURT A.; RAWSON, IAN M.
To: NCC NANO, LLC
Reel/Frame 022511/0146 →
Assignment of Assignor's Interest
Feb 3, 2010
From: SCHRODER, KURT A.; FURLAN, WAYNE; HAMILL, DENNY; MARTIN, KARL
To: NCC NANO, LLC
Reel/Frame 023893/0123 →
Assignment of Assignor's Interest
Feb 24, 2010
From: SCHRODER, KURT A.
To: NCC NANO, LLC
Reel/Frame 023981/0451 →
Assignment of Assignor's Interest
Sep 3, 2010
From: JACKSON, DOUGLAS K.
To: NCC NANO, LLC
Reel/Frame 024935/0764 →
Assignment of Assignor's Interest
Apr 8, 2011
From: SCHRODER, KURT A.; MCCOOL, STEVEN C.; JACKSON, DOUGLAS K.
To: NCC NANO, LLC
Reel/Frame 026095/0550 →
Assignment of Assignor's Interest
Apr 8, 2011
From: JACKSON, DOUGLAS K.; SCHRODER, KURT A.; MCCOOL, STEVEN C.
To: NCC NANO, LLC
Reel/Frame 026095/0579 →
Assignment of Assignor's Interest
Jun 3, 2011
From: SCHRODER, KURT A.; WENZ, ROBERT P.
To: NCC NANO, LLC
Reel/Frame 026384/0765 →
Assignment of Assignor's Interest
Mar 28, 2012
From: SCHRODER, KURT A.; RAWSON, IAN M.; MCCOOL, STEVEN C.; EDD, ANDREW E.
To: NCC NANO, LLC
Reel/Frame 027946/0539 →
Assignment of Assignor's Interest
Apr 24, 2012
From: RAWSON, IAN M.
To: NCC NANO, LLC
Reel/Frame 028096/0307 →
Assignment of Assignor's Interest
Dec 3, 2012
From: EDD, ANDREW E.; MUNSON, CHARLES C.
To: NCC NANO, LLC
Reel/Frame 029394/0487 →
Assignment of Assignor's Interest
Sep 11, 2013
From: SCHRODER, KURT A.; WENZ, ROBERT P.
To: NCC NANO, LLC
Reel/Frame 031186/0862 →
Assignment of Assignor's Interest
Feb 18, 2015
From: SCHRODER, KURT A.; WENZ, ROBERT P.
To: NCC NANO, LLC
Reel/Frame 034978/0531 →
Assignment of Assignor's Interest
Feb 6, 2020
From: INTRINSIQ MATERIALS, INC.; INTRINSIQ MATERIALS, LTD.
To: NCC NANO, LLC
Reel/Frame 051736/0495 →