Method and apparatus for curing thin films on low-temperature substrates at high speeds
A composite film is disclosed. The composite film includes a substrate, a thermal barrier layer located on top of the substrate, wherein the thermal barrier layer has a higher decomposition temperature than the substrate, and a thin film located on top of the thermal barrier layer, wherein the thin film is to be thermally processed by a pulsed light from a flashlamp.
1. A composite film comprising:
a substrate;
a thermal barrier layer located on top of said substrate, wherein said thermal barrier layer has a higher decomposition temperature than said substrate; and
a thin film located on top of said thermal barrier layer, wherein said thin film is to be thermally processed by pulsed light from a flash lamp.
2. The composite film of claim 1 , wherein said substrate is a polymer.
3. The composite film of claim 1 , wherein said thermal barrier layer is a silicon dioxide layer.
4. The composite film of claim 1 , wherein said thermal barrier layer is spin on glass.
5. The composite film of claim 1 , wherein said thermal barrier contains silica particles.
6. The composite film of claim 1 , wherein said thermal barrier contains ceramic particles.
7. The composite film of claim 1 , wherein the thermal barrier contains silane derivatives as binders.
8. The composite film of claim 1 , wherein said thin film has a lower decomposition temperature than said thermal barrier layer.