Method for curing solder paste on a thermally fragile substrate
A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.
1. A method for curing solder paste on a thermally fragile substrate, said method comprising:
printing an optically reflective layer and an optically absorptive layer on said thermally fragile substrate;
selectively depositing a plurality of conductive traces on said optically reflective layer and on said optically absorptive layer;
applying solder paste on selective locations corresponding to locations of said optically absorptive layer;
placing a component on said solder paste; and
irradiating said thermally fragile substrate from one side with uniform pulsed light, wherein said optically absorptive layer absorbs said uniform pulsed light and becomes heated, and said heat is subsequently transferred to said solder paste and said component via thermal conduction to melt said solder paste, wherein said optically reflective layer reflects said uniform pulsed light.
2. The method of claim 1 , wherein locations of said optically absorptive layer correspond to locations of said solder paste utilized to connect to said component.
3. The method of claim 1 , wherein said thermally fragile substrate is optically transparent.
4. The method of claim 1 , wherein said thermally fragile substrate is polyethylene naphthalate (PEN).
5. The method of claim 1 , wherein said thermally fragile substrate is polyethylene terephthalate (PET).
6. The method of claim 1 , wherein said thermally fragile substrate is polycarbonate.
7. The method of claim 1 , wherein said thermally fragile substrate is paper.
8. The method of claim 1 , wherein an area of said optically absorptive layer is directly proportional to a thermal mass of said component and a thermal mass of said solder paste.
9. The method of claim 1 , wherein said solder paste is an alloy including at least one of Sn, Ag, and Cu.
10. The method of claim 1 , wherein an energy of said uniform pulsed light for processing said solder paste is between 3 and 30 J/cm 2 .
11. The method of claim 1 , wherein said component is a surface mount component.