Patent Assignment
Reel/Frame 053684/0504
Assignment of Assignor's Interest
Recorded: 2020-09-03
Pages: 3
Assignor
HENDRIKS, ROB JACOBS
Executed: 2018-01-18
Assignee
NCC NANO, LLC
12221 MERIT DRIVE, THREE FOREST PLAZA, SUITE 930, DALLAS, TEXAS, 75251
Covered Property
(1)
Method for Curing Solder Paste on a Thermally Fragile Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.