Method for performing delamination of a polymer film
A method and apparatus for delaminating a polymer film from a carrier plate is disclosed. The carrier plate is at least partially transparent and has deposited on it a pixelated pattern layer of light-absorptive material, upon which is deposited a layer of light-reflective material. A polymer film, which is to be delaminated, is deposited on the light-reflecting material layer. Next, a pulsed light source is utilized to irradiate through the carrier plate from the side opposite the polymer film to heat the light-absorptive material layer. The heated areas of the light-absorptive material layer, in turn, heat the polymer film through conduction at the interface between the light-absorptive material layer and the polymer film, thereby generating gas from the polymer film by its thermal decomposition, which allows the polymer film to be released from the carrier plate.
1. A method for performing delamination of a polymer film, said method comprising:
providing an optically transparent carrier plate;
depositing a light-absorptive material layer onto said carrier plate;
depositing a light-reflective material layer onto said light-absorptive material layer;
depositing a polymer film on said light-reflective material layer and said light-absorptive material layer;
forming electronic structures on said polymer film; and
irradiating said carrier plate with a pulsed light to heat said light-absorptive material layer in order to release said polymer film from said carrier plate.
2. The method of claim 1 , wherein said irradiating further includes irradiating said carrier plate with a flashlamp.
3. The method of claim 1 , wherein said irradiating generates gas at an interface between said light-absorptive material layer and said polymer film to release said polymer film from said carrier plate.
4. The method of claim 3 , wherein said gas generation level is controlled by changing a ratio between said light-absorptive material layer and said light-reflective material layer.
5. The method of claim 1 , wherein said method further includes depositing a dynamic release layer on said light-reflective material layer before said polymer film is deposited.
6. The method of claim 5 , wherein said dynamic release layer is made of metal.
7. The method of claim 1 , wherein said carrier plate is made of quartz.
8. The method of claim 1 , wherein said carrier plate is made of glass.
9. The method of claim 1 , wherein said light-absorptive material layer is patterned.
10. The method of claim 1 , wherein said light-absorptive material layer is not patterned.
11. A method for performing delamination of a polymer film, said method comprising:
Providing an optically transparent carrier plate;
depositing a first light-absorptive material layer onto said carrier plate;
depositing a thermal retardation layer onto said first light absorptive material layer;
depositing a second light-absorptive material layer onto said second light-absorptive material layer;
depositing a light-reflective material layer onto said second light-absorptive material layer;
depositing a polymer film on said light-reflective material layer and said second light-absorptive material layer;
forming electronic structures on said polymer film; and
irradiating said carrier plate with a pulsed light to heat said light-absorptive material layers in order to release said polymer film from said carrier plate.
12. The method of claim 11 , wherein said irradiating further includes irradiating said carrier plate with a flashlamp.
13. The method of claim 11 , wherein said method further includes depositing a surface tension controlled release layer on said light-reflective material layer before said polymer film is deposited.
14. The method of claim 13 , wherein said surface tension controlled release layer is made of ceramic.
15. The method of claim 13 , wherein said method further includes depositing a dynamic release layer on said surface tension controlled release layer before said polymer film is deposited.
16. The method of claim 15 , wherein said dynamic release layer is made of metal.
17. The method of claim 11 , wherein one of said light-absorptive material layers is patterned.
18. The method of claim 11 , wherein said carrier plate is made of quartz.
19. The method of claim 11 , wherein said carrier plate is made of glass.
20. The method of claim 11 , wherein said thermal retardation layer is made of silicon oxide.