Method and apparatus for removing particles from the surface of a semiconductor wafer

1. An apparatus for removing particles from a surface of a semiconductor wafer, said apparatus comprising:

an enclosure having a condensing environment;

a spin coater for spinning said wafer contained within said enclosure having a condensing environment;

a vapor diffuser for infusing a liquid vapor into said enclosure to allow some of said liquid vapor to be condensed onto a surface of said wafer on which particles may adhere while said wafer is being spun;

a flashlamp for emitting a plurality of light pulses to said surface of said spinning wafer, each light pulse at an angular location across a radius of said spinning wafer after a predetermined amount of time has lapsed as determined by a charging rate of capacitors located within said flashlamp for delivering said each light pulse, until an entire surface of said spinning wafer has received at least one light pulse;

an encoder to determine said angular position of said spinning wafer, and a number of rotations of said spinning wafer; and

an electric grid for carrying said particles off said surface of said wafer.

2. The apparatus of claim 1 , wherein said liquid vapor is acetone.

3. The apparatus of claim 1 , wherein said liquid vapor is water.

4. The apparatus of claim 1 , wherein said light pulses are emitted by said plurality of flashlamp at a stationary position, while said spinning wafer has to complete at least one rotation between two consecutive light pulses.