Method for attaching and detaching substrates during integrated circuit manufacturing
A method for attaching and detaching a substrate from a bonded stack is disclosed. A broadband light-absorbing material is combined with an adhesive material to form a broadband light-absorbing adhesive. A layer of the broadband light-absorbing adhesive is then applied on one side of a transparent carrier. A substrate is placed on the broadband light-absorbing adhesive and the transparent carrier to form a bonded stack. The substrate can be a wafer or a polymeric film. At this point, processing steps can be performed on the substrate. After the processing steps have been completed, a light pulse from a flashlamp is utilized to heat up the broadband light-absorbing adhesive in order to loosen the substrate from the bonded stack such that the substrate can be easily detached from the bonded stack.
1. A method comprising:
combining an adhesive material, a sublimation dye and a light-absorbing material to form a broadband light-absorbing adhesive;
applying a layer of said broadband light-absorbing adhesive on one side of a transparent carrier;
placing a wafer on said broadband light-absorbing adhesive and said transparent carrier to form a wafer stack;
processing said wafer; and
applying a light pulse from a flashlamp to heat up said broadband light-absorbing adhesive layer in order to release said wafer from said wafer stack.
2. The method of claim 1 , wherein said light-absorbing material is a dye.
3. The method of claim 1 , wherein said light-absorbing material is a pigmented material.
4. The method of claim 3 , wherein said pigmented material is carbon black.
5. The method of claim 1 , wherein said carrier is made of quartz.
6. The method of claim 1 , wherein said carrier is made of glass.
7. The method of claim 1 , wherein said sublimation dye gas generating material is a material that sublimates or boils at a temperature lower than the boiling temperature of said adhesive material.
8. The method of claim 1 , wherein said broadband light-absorbing adhesive absorbs greater than 80% of said light pulse from said flashlamp.
9. A method comprising:
combining an adhesive material, a sublimation dye and a light-absorbing material to form a broadband light-absorbing adhesive;
applying a layer of said broadband light-absorbing adhesive on one side of a transparent carrier;
placing a polymeric film on said broadband light-absorbing adhesive and said transparent carrier to form a polymeric film stack;
processing said polymeric film; and
applying a light pulse from a flashlamp to heat up said broadband light-absorbing adhesive layer in order to release said polymeric film from said polymeric film stack.
10. The method of claim 9 , wherein said light-absorbing material is a dye.
11. The method of claim 9 , wherein said light-absorbing material is a pigmented material.
12. The method of claim 11 , wherein said pigmented material is carbon black.
13. The method of claim 9 , wherein said carrier is made of quartz.
14. The method of claim 9 , wherein said carrier is made of glass.
15. The method of claim 14 , wherein said sublimation dye sublimates or boils at a temperature lower than the boiling temperature of said adhesive material.
16. The method of claim 9 , wherein said broadband light-absorbing adhesive absorbs greater than 80% of said light pulse from said flashlamp.