Method and apparatus for removing particles from the surface of a semiconductor wafer

1. An apparatus for removing particles from the surface of a semiconductor wafer, said apparatus comprising:

a spin coater for spinning a wafer;

a liquid dispenser for continuously dispensing a stream of liquid onto a surface of said wafer to which particles may adhere while said wafer is being spun;

an encoder connected to said spin coater for determining an angular position of said spinning wafer, and a number of rotations of said spinning wafer;

a flashlamp for emitting a plurality of light pulses to said surface of said spinning wafer while liquid is being dispensed on said spinning wafer, each of said light pulses emitted at said angular location across a radius of said spinning wafer after a predetermined amount of time has lapsed as determined by a charging rate of capacitors located within said flashlamp for delivering said each light pulse, until an entire surface of said spinning wafer has received at least one light pulse; and

a particle collector for collecting said particles carried off said wafer by said stream of liquid.

2. The apparatus of claim 1 , wherein said liquid is dispensed near the center of said wafer.

3. The apparatus of claim 1 , wherein said liquid is an inorganic solvent.

4. The apparatus of claim 1 , wherein said liquid is water.

5. The apparatus of claim 1 , wherein said liquid is an organic solvent.

6. The apparatus of claim 1 , wherein said liquid is alcohol.

7. The apparatus of claim 1 , wherein liquid dispensing from said liquid dispenser is metered with a constant displacement pump.

8. The apparatus of claim 1 , wherein said liquid dispenser is controlled by a mass flow controller that is switched on and off via a solenoid.

9. The apparatus of claim 1 , wherein said apparatus further includes an air jet to dry said wafer.

10. The apparatus of claim 1 , wherein said wafer has completed at least one rotation between two consecutive light pulses from said flashlamp.