Apparatus, system, and method for transferring heat from memory components
View Patent ↗The apparatus to transfer heat from memory components includes a first non-volatile memory component and a second non-volatile memory component. The apparatus includes a heat spreading material in thermal communication with the first non-volatile memory component and the second non-volatile memory component. The heat spreading material is configured to transfer heat from the first non-volatile memory component and the second non-volatile memory component.
1. An apparatus comprising:
one or more substrates configured to provide mechanical support and electrical connections for a plurality of non-volatile memory components;
a thermally conductive material configured to transfer heat from the plurality of non-volatile memory components; and
a controller configured to execute one or more temperature dependent management functions on two or more of the plurality of non-volatile memory components in parallel.
2. The apparatus of claim 1 , wherein the thermally conductive material is configured to cover a top surface of each of the plurality of non-volatile memory components, and to cover at least a portion of one or more side surfaces of each of the plurality of non-volatile memory components.
3. The apparatus of claim 2 , wherein the thermally conductive material comprises:
an elongate sheet configured to cover the top surfaces of each of the plurality of non-volatile memory components; and
one or more extensions configured to cover at least a portion of the one or more side surfaces of the plurality of non-volatile memory components.
4. The apparatus of claim 3 , wherein an extension of the thermally conductive material is configured to cover side surfaces of two or more of the plurality of non-volatile memory components.
5. The apparatus of claim 1 , wherein a first memory component of the plurality of non-volatile memory components is disposed on a first side of a substrate of the one or more substrates, and a second memory component of the plurality of non-volatile memory components is disposed on a second side of the substrate, opposite the first side, and wherein the thermally conductive material is thermally coupled to a top surface of both the first memory component and the second memory component.
6. The apparatus of claim 1 , wherein the one or more temperature dependent management functions comprise one or more of garbage collection operations on the non-volatile memory components, determining a data retention time for data stored on the non-volatile memory components, determining an expected error rate for data stored on respective non-volatile memory components, and determining read voltage levels for the non-volatile memory components.
7. An apparatus comprising:
a heat spreading material in thermal communication with a first non-volatile memory component and a second non-volatile memory component, the heat spreading material configured to transfer heat from the first non-volatile memory component and the second non-volatile memory component; and
a controller configured to execute one or more temperature dependent management functions in parallel on the first non-volatile memory component and the second non-volatile memory component.
8. The apparatus of claim 7 , wherein the heat spreading material comprises a thermally anisotropic material having higher thermal conductivity within a plane of the heat spreading material than through the plane.
9. The apparatus of claim 8 , wherein the thermally anisotropic material comprises a graphite based material.
10. The apparatus of claim 7 , wherein the heat spreading material comprises a thermally isotropic material.
11. The apparatus of claim 10 , wherein the thermally isotropic material comprises one of a copper material and an aluminum material.
12. The apparatus of claim 7 , wherein the heat spreading material comprises an elongate sheet disposed adjacent to the first and second non-volatile memory components.
13. The apparatus of claim 7 , wherein the heat spreading material comprises a heat pipe disposed adjacent to the first and second non-volatile memory components.
14. The apparatus of claim 7 , further comprising one or more substrates for the first non-volatile memory component and the second non-volatile memory component, the one or more substrates providing mechanical support and electrical connections for the first and second non-volatile memory components.
15. The apparatus of claim 7 , wherein the controller is disposed adjacent to one of the first non-volatile memory component and the second non-volatile memory component such that the controller increases heat in the one of the first non-volatile memory component and the second non-volatile memory component.
16. The apparatus of claim 7 , wherein the first and second non-volatile memory components are electrically coupled to one or more memory buses in parallel.
17. The apparatus of claim 7 , wherein the one or more temperature dependent management functions comprise managing a frequency of garbage collection operations on the first non-volatile memory component and the second non-volatile memory component.
18. The apparatus of claim 7 , wherein the one or more temperature dependent management functions comprise determining read voltage levels for the first non-volatile memory component and the second non-volatile memory component.
19. A system comprising:
one or more substrates;
a first non-volatile memory component disposed on the one or more substrates;
a second non-volatile memory component disposed on the one or more substrates;
a thermally conductive material in thermal communication with the first non-volatile memory component and the second non-volatile memory component, the thermally conductive material configured to decrease heat in one of the first non-volatile memory component and the second non-volatile memory component; and
a hardware controller for the first non-volatile memory component and the second non-volatile memory component, wherein the hardware controller is configured to execute one or more temperature dependent management functions in parallel on the first non-volatile memory component and the second non-volatile memory component.
20. The system of claim 19 , further comprising a host device in communication with the hardware controller over one or more system buses.
21. The system of claim 19 , wherein the hardware controller is disposed adjacent to one of the first non-volatile memory component and the second non-volatile memory component such that the hardware controller increases heat in the one of the first non-volatile memory component and the second non-volatile memory component.
22. The system of claim 19 , wherein the first non-volatile memory component and the second non-volatile memory component are disposed on a first side of the one or more substrates, the system further comprising a third non-volatile memory component disposed on a second side of the one or more substrates and a fourth non-volatile memory component disposed on the second side of the one or more substrates.
23. The system of claim 22 , wherein the thermally conductive material is in thermal communication with the third non-volatile memory component and the fourth non-volatile memory component.
24. The system of claim 22 , further comprising a second thermally conductive material in thermal communication with the third non-volatile memory component and the fourth non-volatile memory component.
25. The system of claim 19 , wherein the one or more temperature dependent management functions include determining a frequency for garbage collection operations on each of the first non-volatile memory component and the second non-volatile memory component.
26. The system of claim 19 , wherein the one or more temperature dependent management functions include determining respective read voltage levels for the first non-volatile memory component and the second non-volatile memory component.