Adhesive compositions containing graphenic carbon particles
Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having a compressed density of 0.9 or less. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.
1. An adhesive composition comprising:
(a) a first component:
(b) a second component that chemically reacts with said first component; and
(c) graphenic carbon particles having a compressed density of of from 0.6 g/cm 3 to 0.9 g/cm 3 .
2. The adhesive composition of claim 1 , wherein said second component chemically reacts with said first component without the need for activation from an external energy source.
3. The adhesive composition of claim 1 , wherein said graphenic carbon particles comprise from 1 to 10 weight percent of the total weight of the adhesive composition.
4. The adhesive composition of claim 2 , wherein a mixture comprising (a) and (c) is stored separately from (b), wherein a shear thinning ratio at 45 degrees Celsius of the mixture is at least 20 percent greater than the shear thinning ratio at 45 degrees Celsius of a comparative mixture comprising component (a) but not including (c).
5. The adhesive composition of claim 2 , wherein a mixture comprising (a) and (c) is stored separately from (b), wherein a viscosity recovery ((T3) at 17 minutes) of the mixture is at least 3 times greater than the viscosity recovery ((T3) at 17 minutes) of a comparative mixture comprising component (a) but not including (c).
6. The adhesive composition of claim 2 , wherein a mixture comprising (a) and (c) is stored separately from (b), wherein a Thixotropic Index of the mixture is at least 25 percent greater than the Thixotropic Index of a comparative mixture comprising component (a) but not including (c).
7. A method for forming a bonded substrate comprising:
applying the adhesive composition of claim 3 to a first substrate;
contacting a second substrate to the adhesive composition such that the adhesive composition is located between said first substrate and said second substrate; and
curing the adhesive composition.
8. The adhesive composition of claim 1 , wherein said second component chemically reacts with said first component after mixing and upon activation from an external energy source.
9. The adhesive composition of claim 8 , wherein said second component (b) comprises a heat activated latent curing agent.
10. The adhesive composition of claim 9 , wherein a shear thinning ratio at 45 degrees Celsius of the adhesive composition is at least 20 percent greater than the shear thinning ratio at 45 degrees Celsius of a comparative adhesive composition comprising components (a) and (b), but not comprising (c).
11. The adhesive composition of claim 9 , wherein a viscosity recovery of the adhesive composition is at least 2 times greater than the viscosity recovery of a comparative adhesive composition comprising components (a) and (b), but not comprising (c).
12. The adhesive composition of claim 9 , wherein a Thixotropic Index of the adhesive composition is at least 20 percent greater than the Thixotropic Index of a comparative adhesive composition comprising components (a) and (b), but not comprising (c).
13. A method for forming a bonded substrate comprising:
applying the adhesive composition of claim 9 to a first substrate;
contacting a second substrate to the adhesive composition such that the adhesive composition is located between said first substrate and said second substrate; and
curing the adhesive composition.
14. An adhesive composition comprising:
(a) a first component:
(b) a second component that chemically reacts with said first component; and
(c) graphenic carbon particles, wherein a 0.5% by weight solution of said graphenic carbon particles in butyl cellosolve has a bulk liquid conductivity of at least 100 microSiemens as measured by a Fisher Scientific AB 30 conductivity meter wherein the graphenic carbon particles have a compressed density of from 0.6 g/cm 3 to 0.9 g/cm 3 .
15. The adhesive composition of claim 14 , wherein a 0.5% by weight solution of said graphenic carbon particles in butyl cellosolve has a conductivity of at least 120 microSiemens as measured by a Fisher Scientific AB 30 conductivity meter.
16. The adhesive composition of claim 14 , wherein a 0.5% by weight solution of said graphenic carbon particles in butyl cellosolve has a conductivity of at least 140 microSiemens as measured by a Fisher Scientific AB 30 conductivity meter.
17. The adhesive composition of claim 14 , wherein said graphenic carbon particles comprise from 1 to 10 weight percent of the total weight of the adhesive composition.
18. A method for forming a bonded substrate comprising:
applying the adhesive composition of claim 14 to a first substrate;
contacting a second substrate to the adhesive composition such that the adhesive composition is located between said first substrate and said second substrate; and
curing the adhesive composition.
19. A coating composition comprising:
a film forming polymer; and
graphenic carbon particles having a compressed density of from 0.6 g/cm 3 to 0.9 g/cm 3 .
20. The adhesive composition of claim 1 , wherein the graphenic carbon particles have an oxygen content of no more than 2 atomic weight percent.