MOUNTING DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE
To mount electronic components with different types of electrodes en masse on a substrate, the present invention comprises a heating section that heats an electrode of a first electronic component and an electrode of a second electronic component among the plurality of electronic components; a heat releasing section that releases heat from the electrode of the first electronic component and the electrode of the second electronic component; a first thermally conductive member disposed between the electrode of the first electronic component and the heating section or the heat releasing section; and a second thermally conductive member disposed between the electrode of the second electronic component and the heating section or the heat releasing section. The first thermally conductive member and the second thermally conductive member have different amounts of heat transfer per unit time.
1 . A mounting device that bonds a plurality of electronic components to a substrate using thermal compression, comprising:
a heating section that heats an electrode of a first electronic component and an electrode of a second electronic component among the plurality of electronic components;
a heat releasing section that releases heat from the electrode of the first electronic component and the electrode of the second electronic component;
a first thermally conductive member disposed between the electrode of the first electronic component and the heating section or the heat releasing section; and
a second thermally conductive member disposed between the electrode of the second electronic component and the heating section or the heat releasing section, wherein
the first thermally conductive member and the second thermally conductive member have different amounts of heat transfer per unit time.
2 . The mounting device according to claim 1 , further comprising:
a stage on which the substrate is to be loaded; and
a head that presses the first electronic component against the substrate via the first thermally conductive member and presses the second electronic component against the substrate via the second thermally conductive member.
3 . The mounting device according to claim 2 , wherein
the first thermally conductive member and the second thermally conductive member are formed by an elastomer.
4 . The mounting device according to claim 2 , wherein
the stage includes:
a first individual stage corresponding to a region where the first thermally conductive member is to be arranged; and
a second individual stage corresponding to a region where the second thermally conductive member is to be arranged, and
the heating section heats the electrode of the first electronic component via the first individual stage and heats the electrode of the second electronic component via the second individual stage.
5 . The mounting device according to claim 1 , wherein
the first thermally conductive member and the second thermally conductive member have different thermal conduction rates.
6 . The mounting device according to claim 1 , wherein
the amount of heat transfer per unit time of the first thermally conductive member is determined according to the type of electrode of the first electronic component, and
the amount of heat transfer per unit time of the second thermally conductive member is determined according to the type of electrode of the second electronic component.
7 . A method for manufacturing an electronic module in which a plurality of electronic components are mounted on a substrate, comprising:
temperature adjustment of adjusting the temperatures of an electrode of a first electronic component and an electrode of a second electronic component, from among the plurality of electronic components, to be different temperatures; and
thermal compression bonding of bonding the first electronic component and the second electronic component to the substrate using thermal compression.
8 . The manufacturing method according to claim 7 , wherein
the method is performed by a mounting device including a heating section that heats each electrode of the first electronic component and the second electronic component, a heat releasing section that releases heat from each electrode of the first electronic component and the second electronic component, a first thermally conductive member disposed between the electrode of the first electronic component and the heating section or the heat releasing section, and a second thermally conductive member disposed between the electrode of the second electronic component and the heating section or the heat releasing section,
the first thermally conductive member and the second thermally conductive member have different amounts of heat transfer per unit time, and
the temperature adjustment includes adjusting the temperatures of each electrode of the first electronic component and the second electronic component to be a different temperature by heating the electrodes of the first electronic component and the second electronic component with the heating section and releasing heat from the electrodes of the first electronic component and the second electronic component using the heat releasing section.
9 . The manufacturing method according to claim 8 , wherein
the mounting device further includes:
a stage on which the substrate is to be loaded; and
a head that presses the first electronic component against the substrate via the first thermally conductive member and presses the second electronic component against the substrate via the second thermally conductive member, and
the thermal compression bonding includes:
loading of loading the substrate on the stage; and
pressing of the head pressing the first electronic component against the substrate via the first thermally conductive member and pressing the second electronic component against the substrate via the second thermally conductive member.
10 . The manufacturing method according to claim 9 , wherein
the first thermally conductive member and the second thermally conductive member are formed by an elastomer.
11 . The manufacturing method according to claim 7 , further comprising film arrangement of, prior to the temperature adjustment, arranging an adhesive film that includes a thermosetting resin between the substrate and the first electronic component and between the substrate and the second electronic component, wherein
the thermal compression bonding includes bonding the first electronic component and the second electronic component to the substrate using thermal compression, by thermally hardening the adhesive film.