Membrane assembly and carrier head having the membrane assembly
Provided is a membrane assembly of a carrier head in a chemical-mechanical polishing apparatus. The membrane assembly includes a main membrane and a circular ring. The main membrane has a wafer contacting surface in contact with a wafer while a chemical-mechanical polishing process is being performed. The circular ring is disposed at an edge portion of the main membrane and receives an air pressure to downwardly apply the air pressure to the main membrane at the edge portion.
1. A membrane assembly of a carrier head in a chemical-mechanical polishing apparatus, comprising:
a main membrane having a wafer contacting surface in contact with a wafer, a wing portion that vertically extends an edge portion of the main membrane and an edge chamber extending from the wing portion; and
a circular ring disposed at an edge portion of the main membrane, the circular ring having a hollow section which is formed to have an inclined surface inclined with respect to the wafer contacting surface of the main membrane,
wherein the edge chamber applies pressure to the inclined surface of the circular ring and the circular ring applies pressure to the main membrane when air pressure is applied to the edge chamber.
2. The membrane assembly of claim 1 , further comprising a dividing membrane that has at least one partition for defining chambers and is disposed on a top surface of the main membrane.
3. The membrane assembly of claim 2 , wherein the dividing membrane comprises a ring-shaped pressurizing protrusion formed on a top surface thereof.
4. The membrane assembly of claim 2 , wherein the main membrane has a thickness greater than the dividing membrane.
5. The membrane assembly of claim 2 , wherein the edge portion of the main membrane includes an edge wing, the edge wing having a protruded portion formed on an inner surface of the edge wing, and a receiving groove for receiving the dividing membrane.
6. The membrane assembly of claim 1 , wherein the circular ring comprises an outer wall that contacts an inner surface of an edge wing of the main membrane, the inclined surface that is disposed at an opposite surface of the outer wall to change the direction of the air pressure from a horizontal direction to a vertical direction, and a downward protrusion that extends downwardly from the outer wall and the inclined surface.
7. The membrane assembly of claim 1 , wherein the edge chamber comprises an inclined portion which directly contacts the inclined surface of the circular ring.
8. A membrane assembly of a carrier head in a chemical-mechanical polishing apparatus, comprising:
a main membrane having a wafer contacting surface in contact with a wafer, a wing portion that vertically extends from an edge portion of the main membrane and an edge chamber extending from the wing portion;
a circular ring disposed at an edge portion of the main membrane, and
a dividing membrane that has at least one partition for defining chambers and is disposed on a top surface of the main membrane,
wherein the edge chamber applies pressure to the circular ring and the circular ring applies pressure to the main membrane when air pressure is applied to the edge chamber and wherein the main membrane comprises a location fixing protrusion formed at a location on the top surface thereof, corresponding to a central through hole of the dividing membrane.
9. The membrane assembly of claim 8 , wherein the circular ring has a hollow section which is formed to have an inclined surface inclined with respect to the wafer contacting surface of the main membrane, and wherein the edge chamber applies pressure to the inclined surface of the circular ring and the circular ring applies pressure to the main membrane when air pressure is applied to the edge chamber.
10. A carrier head comprising:
the membrane assembly of any one of claims 1 , 2 - 6 and 7 - 9 ; and
an air passage for supplying a pressure to a main membrane of the membrane assembly.