Apparatus for laser peening hidden surfaces
Methods, systems, and apparatuses are disclosed for laser peening hidden surfaces. In one embodiment, a laser processing pen is provided, the laser processing pen comprising: an elongated member, comprising: a laser pulse entry portion; a laser pulse exit portion, wherein the laser pulse exit portion includes at least one optical lens; and at least one tape guide capable of channeling at least a non-adhesive tape overlay in proximity of the laser pulse exit portion.
1. A laser processing pen, comprising:
an elongated member, comprising:
a laser pulse entry portion;
a laser pulse exit portion, wherein the laser pulse exit portion includes at least one optical lens;
at least two tape guides attached to a periphery of the elongated member, each of the at least two tape guides each comprising a peripheral edge and a channel between the peripheral edge and the elongated member, the channel capable of guiding at least a non-adhesive tape overlay longitudinally along the elongated member, around a distal end of the elongated member, and in proximity of the laser pulse exit portion; and
at least one spacer configured to create a desired space between the laser pulse exit portion and a workpiece surface.
2. The laser processing pen of claim 1 , wherein the optical lens is capable of focusing a laser pulse to at least one of a circular, an elliptical, and a rectangular cross-section.
3. The laser processing pen of claim 1 , wherein the at least one optical lens has a diameter between 2 mm and 10 mm.
4. The laser processing pen of claim 1 , further comprising at least one capillary tube capable of applying a transparent overlay to at least one of a workpiece surface, an opaque overlay, the at least one optical lens, and the laser pulse exit portion.
5. The laser processing pen of claim 1 , wherein the at least one spacer comprises a spacing ball.
6. The laser processing pen of claim 1 , wherein the at least one spacer comprises a spring biasing device.
7. An apparatus for laser peening a workpiece, comprising:
a laser beam source;
a beam delivery system;
a laser processing pen;
an overlay application system;
at least two tape guides attached to a periphery of the laser processing pen, each of the at least two tape guides comprising a peripheral edge and a channel between the peripheral edge and the laser processing pen, the channel capable of guiding at least a non-adhesive tape overlay longitudinally along the laser processing pen, and around a distal end of the laser processing pen; and
at least one spacing apparatus capable of maintaining a desired spacing between the laser processing pen and the tape overlay.
8. The apparatus of claim 7 , wherein the beam delivery system comprises an articulated arm.
9. The apparatus of claim 7 , wherein the laser processing pen comprises at least one optical lens having a diameter between 2 mm and 10 mm.
10. The apparatus of claim 7 , wherein the overlay application system comprises a transparent overlay system.
11. The apparatus of claim 7 , wherein the overlay application system comprises an opaque overlay application system comprising at least one automatic tape advancing device capable of advancing a tape overlay adjacent to the laser processing pen.
12. The apparatus of claim 7 , wherein the beam delivery system comprises a fiber optic device.
13. The apparatus of claim 7 , wherein the at least one spacing apparatus comprises a spring biasing device.
14. An apparatus for laser peening a workpiece, comprising:
a laser beam source;
a beam delivery system;
a laser processing pen operatively connected to an overlay application system; and
at least two tape guides attached to a periphery of the laser processing pen, each of the at least two tape guides comprising a peripheral edge and a channel between the peripheral edge and the laser processing pen, the channel capable of guiding at least a non-adhesive tape overlay longitudinally along the laser processing pen, and around a distal end of the laser processing pen.
15. The apparatus of claim 14 , wherein the beam delivery system comprises an articulated arm configured to pivot about at least one axis.
16. The apparatus of claim 14 , wherein the laser processing pen comprises at least one optical lens having a diameter of less than about between 2 mm and 10 mm.
17. The apparatus of claim 14 , wherein the overlay application system comprises a transparent overlay application system.
18. The apparatus of claim 14 , wherein the overlay application system comprises an opaque overlay application system.
19. The apparatus of claim 14 , wherein the overlay application system comprises an opaque overlay application system, the opaque overlay application system comprising at least one automatic tape advancing device capable of advancing a tape overlay adjacent to the laser processing pen.
20. The apparatus of claim 14 , wherein the beam delivery system comprises a fiber optic device.