IP Library › Granted Patent US 8,750,550
Granted Patent B2
US 8,750,550 · App. 13/494,336 · Granted Jun 10, 2014

MEMS microphone

Inventors: Sang Ho Lee (Incheon, KR); Yong Hyun Shim (Incheon, KR)
Assignee: BSE Co., Ltd.
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Quick Facts
Patent No.
US 8,750,550
App. No.
13/494,336
Granted
Jun 10, 2014
Kind
B2
Abstract

A MEMS microphone includes a case having sidewalls, a top wall, and an opened bottom; a PCB attached to the bottom of the case; a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and at least one sound hole formed through a surface of the case for introduction of external sounds, wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space.

Claims (32)

1. A micro electro mechanical system (MEMS) microphone comprising:

a case having sidewalls, a top wall, and an opened bottom;

a printed circuit board (PCB) attached to the bottom of the case;

a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and

at least one sound hole formed through a surface of the case for introduction of external sounds,

wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space, wherein the internal communicating unit comprises:

a first communicating member attached to the sound hole and having a first sound path in communication with the sound hole; and

a second communicating member which is attached to an upper surface of the PCB, the second communicating member having a second sound path extending over the PCB so as to be in communication with the first sound path.

2. The MEMS microphone of claim 1 , wherein the first communicating member is formed of an elastic rubber,

the second communicating member is formed of a circuit board material or a metal, and

the MEMS chip is mounted on the second communicating member.

3. The MEMS microphone of claim 1 , wherein the first communicating member is formed of an elastic rubber.

4. The MEMS microphone of claim 1 , wherein the sound hole is formed in one of the sidewalls.

5. The MEMS microphone of claim 1 , wherein the first communicating member and the second communicating member are two distinct and separable components, and the first member is attached to the second member.

6. The MEMS microphone of claim 1 , wherein the second communicating member has an opening formed in a top wall of the second communicating member, and the MEMS chip is arranged on the top wall of the second communicating member and over the opening.

7. The MEMS microphone of claim 6 , wherein the MEMS chip is electrically connected to the second communicating member.

8. The MEMS microphone of claim 1 , wherein the second communicating member has an open bottom, and the bottom of the second communicating member is attached to the PCB such that the second sound path is formed by both the PCB and the second communicating member.

9. A micro electro mechanical system (MEMS) microphone comprising: a case having sidewalls, a top wall, and an opened bottom; a printed circuit board (PCB) attached to the bottom of the case; a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and at least one sound hole formed through a surface of the case for introduction of external sounds, wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space, wherein the internal communicating unit comprises: a communicating member attached to an inner side surface of the case, the communicating member having a first end attached to the sound hole, wherein the sound path passes through the communicating member,

wherein the communicating member is a first communicating member and the MEMS microphone further comprises a second communicating member attached to an upper surface of the PCB, wherein a first sound path of the first communicating member is in communication with a second sound path of the second communicating member.

10. The MEMS microphone of claim 9 , wherein the communicating member has an open side, and the open side of the communicating member is attached to an inner side surface of the case such that at least a portion of the sound path is formed by both the case and the communicating member.

11. The MEMS microphone of claim 9 , wherein the MEMS chip is electrically connected to the second communicating member.

12. The MEMS microphone of claim 9 , wherein the first communicating member and the second communicating member are two distinct and seperable components, and the first member is attached to the second member.

13. The MEMS microphone of claim 9 , wherein the first communicating member is formed of an elastic rubber,

the second communicating member is formed of a circuit board material or a metal, and

the MEMS chip is mounted on the second communicating member.

14. The MEMS microphone of claim 9 , wherein the internal communicating unit further comprises an inside-PCB sound path,

a sound path communicating with the sound hole is arranged in the communicating member,

a first end of the communicating member is attached to the sound hole,

a second end of the communicating member is attached to a circuit communicating location on the top surface of the PCB, and

the inside-PCB sound path is formed in the PCB such that the inner-MEMS space and the circuit communicating location communicate with each other such that external sounds introduced via the sound hole pass through the sound path of the first communicating member and the inner-PCB sound path of the PCB and enter the inner-MEMS space.

15. The MEMS microphone of claim 9 , wherein the first communicating member is formed of an elastic rubber.

16. The MEMS microphone of claim 9 , wherein the sound hole is formed in one of the sidewalls.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT SERIAL NUMBER (13/494334)ON THE COVER SHEET - WHICH SHOULD BE 13/494336 PREVIOUSLY RECORDED ON REEL 028359 FRAME 0743. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF US SERIAL NUMBER 13494336. Recorded Jun 20, 2012
From: LEE, SANG HO; SHIM, YONG HYUN
To: BSE CO., LTD.
Reel/Frame 028414/0373 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2012
From: LEE, SANG HO; SHIM, YONG HYUN
To: BSE CO., LTD.
Reel/Frame 028359/0743 →
Priority Claims (1)
KR 10-2011-0127252 · Nov 30, 2011 · national
Continuity (1)
Related Publication 20130136291A1 · May 30, 2013