A test carrier includes a base member and a cover member between which a die is interposed. The base film of the base member has: first interconnect patterns which are formed in advance; and a printing region where second interconnect patterns which electrically connect to the first interconnect patterns are to be formed by printing.
1. A test carrier which comprises a first member and a second member between which an electronic device is interposed, wherein
the first member has first conduction paths which are formed in advance, and
one of the first member or the second member has a first printing region where second conduction paths which are electrically connected to the first conduction paths are to be formed by printing,
wherein the first member has:
a first film; and
a first frame which is formed with a first opening and to which the first film is adhered,
the second member has:
a second film which faces the first film; and
a second frame which is formed with a second opening and to which the second film is adhered,
the first printing region is provided on one of the first film or the second film, and
the electronic device is interposed between the first film and the second film.
2. The test carrier as set forth in claim 1 , wherein the first conduction paths are connected to external terminals which are provided on the first film.
3. The test carrier as set forth in claim 1 , wherein
the first conduction paths are connected to external terminals which are provided on the first frame.
4. The test carrier as set forth in claim 1 , wherein
the electronic device is a die which is obtained by dicing from a semiconductor wafer.
5. The test carrier as set forth in claim 1 , wherein
a holding space which is formed between the first member and the second member and which holds the electronic device is reduced in pressure compared with the outside air.
6. The test carrier as set forth in claim 1 , wherein
the first printing region is defined by a continuous region extending around a position at which the electronic device is configured to be placed, the continuous region having a surface that is configured to be provided with the second conduction paths.
7. The test carrier as set forth in claim 1 , wherein
one of the first member or the second member has:
the second conduction paths; and
an insulating layer which is formed over the parts of the second conduction paths corresponding to the edge of the electronic device.
8. The test carrier as set forth in claim 7 , wherein the second conduction paths have pads which contact electrodes of the electronic device.