Method for providing improved power distribution or power dissipation to an electrical component attached to main circuit board
The present invention provides a method for embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blind vias are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. With this methodology a resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component.
1. A method for providing improved power distribution or power dissipation to an electrical component attached to a main circuit board, comprising the steps of:
Embedding one or more power modification components inside of at least one adaptor board between vias of said adaptor board, said one or more power modification components having terminals in an electrical contact with a pad of said adaptor board, said pad having defined isotropic conductive elastomer thereon so that electricity conducts through said one or more power modification components to place said one or more power modification components close to said electrical component to reduce an electrical length between the one or more power modification components and said electrical component thereby reducing inductance said pad defined isotropic conductive elastomer is with a compression stop;
sandwiching said adaptor board to be sandwiched between said electrical component and the main circuit board and connecting said adaptor board the main circuit board;
locating said one or more embedded components to extend over and beyond the vias or blind vias of said main circuit board so that a portion of the adaptor board containing the embedded power modification component is located beyond where vias or blind vias of the main circuit board are located to permit that via of the main circuit board to conduct through the opening so that said power modification component is at a closer contact point to said electrical component thereby increasing power distribution or power dissipation, respectively.
2. The method according to claim 1 wherein said power modification component is a capacitance.
3. The method according to claim 1 wherein said power modification component is a resistance.
4. The method according to claim 1 wherein said vias are vertically aligned on top of one another to provide for a finer pitch.