IP Library Granted Patent US 8,985,818
Granted Patent B2
US 8,985,818 · App. 13/508,676 · Granted Mar 24, 2015

LED mounting substrate

Inventors: Daisuke Kitagawa (Osaka, JP); Yoshinari Takayama (Osaka, JP); Ichiro Suehiro (Osaka, JP); Hideyuki Usui (Osaka, JP); Takashi Oda (Osaka, JP)
Assignee: Nitto Denko Corporation
H05K1/0373C08L27/18H01L23/3735H01L33/60H01L33/641H05K3/0061H05K2201/015H05K2201/0209H05K2201/10106H01L2224/48091H01L2924/3025
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Quick Facts
Patent No.
US 8,985,818
App. No.
13/508,676
Granted
Mar 24, 2015
Kind
B2
Abstract

The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet ( 10 )) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m·K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.

Claims (15)

1. An LED mounting substrate, comprising:

a layer made of a composition containing boron nitride powder and a fluororesin, wherein

the fluororesin contains polytetrafluoroethylene,

the layer has a thermal conductivity of 2 W/(m·K) or more,

the layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm,

a content of the boron nitride powder in the composition is in a range of 80 to 90% by mass,

a content of the fluororesin in the composition is in a range of 10 to 20% by mass,

the fluororesin further contains a fusible fluororesin, and

a content of the fusible fluororesin in the fluororesin is in a range of 5 to 50% by mass.

2. The LED mounting substrate according to claim 1 , wherein the fusible fluororesin contains at least one selected from the group consisting of perfluoroalkoxy fluororesins and tetrafluoroethylene-hexafluoropropylene copolymer.

3. The LED mounting substrate according to claim 1 , further comprising a wiring pattern formed on a surface of the layer.

4. The LED mounting substrate according to claim 1 , disposed on a radiator.

5. The LED mounting substrate according to claim 1 , wherein the layer has a porosity ranging from 5 to 30% by volume.

6. The LED mounting substrate according to claim 1 , wherein the layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm after heating at 200° C. for 72 hours, and a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm after heating at 120° C. for 360 hours.

7. The LED mounting substrate according to claim 1 , wherein the boron nitride powder contains an aggregate of flaky boron nitride particles.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2012
From: KITAGAWA, DAISUKE; TAKAYAMA, YOSHINARI; SUEHIRO, ICHIRO; USUI, HIDEYUKI; ODA, TAKASHI
To: NITTO DENKO CORPORATION
Reel/Frame 028177/0795 →
Priority Claims (1)
JP 2009-268723 · Nov 26, 2009 · national
Continuity (1)
Related Publication 20120230043A1 · Sep 13, 2012