IP Library Patent Application 13514998
Patent Application
App. No. 13/514,998

PRINTING CIRCUIT BOARD WITH MICRO-RADIATORS

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Quick Facts
Patent No.
US None
App. No.
13/514,998
Abstract

The present invention relates to a printing circuit board with micro-radiators. The printing circuit board includes a substrate, the substrate includes multi-layer copper clad plates and multi-layer prepregs, the multi-layer copper clad plates and the multi-layer prepregs are cross-laminated, the printing circuit board also includes at least one cylindrical micro-radiator embedded into a cylindrical hole of the substrate, the height of the insulating microradiator is equal to the thickness of the substrate, an upper surface and a lower surface of the micro-radiator are covered by copper foils, a heating element is installed on one of the surfaces of the insulating micro-radiator, the other surface of the insulating micro-radiator is isolated from other circuits of the printing circuit board. The present invention combines the micro-radiator with high thermal conductivity and traditional rigid printing circuit board. The present invention has the advantages of high thermal conductivity and stable heat transfer.

Claims (3)

1 - 2 . (canceled)

3 . The printing circuit board of claim 1 , wherein the micro-radiator is elliptic cylindrical, cube-shaped or cylinder shape, when the microradiator is cylinder shape, both the upper surface and the lower surface are rhombus, triangle or trapezoid.

4 - 10 . (canceled)

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2013
From: WANG, ZHENG
To: RAYBEN TECHNOLOGIES (ZHUHAI) LIMITED
Reel/Frame 030433/0019 →