Vertically foldable memory array structure

1. A vertically foldable memory array structure, comprising:

a memory module distributed in columns and rows, the memory module comprising:

a drain selection transistor;

a bottom connecting line and a source selection transistor; and

a plurality of memory cell transistors connected between the drain selection transistor and the bottom connecting line and between the source selection transistor and the bottom connecting line, wherein

a gate of each of the plurality of memory cell transistors is connected to a word line, a drain of each drain selection transistor is connected to a bit line, a drain of a drain selection transistor in a M th vertically foldable memory module in a N th column and a source of a source selection transistor in a (M−1) th memory module in a (N+1) th column are connected to a same bit line, gates of the drain selection transistors and the source selection transistors in all the memory modules in the N th column are connected to a same drain selection line and a same source selection line respectively, in which N and M are an integer.

2. The vertically foldable memory array structure according to claim 1 , wherein the memory cell transistor comprises:

a tubular polysilicon body filled with an insulating dielectric; and

a tubular gate structure surrounding the tubular polysilicon body.

3. The vertically foldable memory array structure according to claim 2 , wherein the tubular gate structure comprises a tubular tunneling oxide layer, a tubular silicon nitride layer, a tubular blocking oxide layer and a tubular gate layer sequentially surrounding the tubular polysilicon body.

4. The vertically foldable memory array structure according to claim 1 , wherein the memory cell transistor is a charge trapping type memory or a nano-crystal memory.

5. The vertically foldable memory array structure according to claim 1 , wherein if a programming voltage is applied to a word line of a selected memory cell transistor, a memory cell transistor between the selected memory cell transistor and the drain selection transistor is turned on, a memory cell transistor between the selected memory cell transistor and the source selection transistor is turned off, a programming voltage is applied to a bit line connected to a drain selection transistor which the selected memory cell transistor connects to, and a grounding voltage is applied to other bit lines, then a programming write operation is performed for the selected memory cell transistor.

6. The vertically foldable memory array structure according to claim 1 , wherein if an erasing voltage is applied to a word line of one or more selected memory cell transistors, a grounding voltage is applied to a drain selection line of a drain selection transistor and a source selection line of a source selection transistor connected to the one or more selected memory cell transistors, and a grounding voltage is applied to all the bit lines, then an erasing operation is performed for the one or more selected memory cell transistors.

7. The vertically foldable memory array structure according to claim 1 , wherein if a reading voltage is applied to a word line of a selected memory cell transistor, a reading passing voltage is applied to a drain selection line of a drain selection transistor and a source selection line of a source selection transistor connected to the selected memory cell transistor as well as an unselected word line, a reading voltage and a grounding voltage are applied to bit lines connected to a drain of the drain selection transistor and a source of the source selection transistor respectively, and other unselected bit lines are floated, then a reading operation is performed for the selected memory cell transistor.

8. The vertically foldable memory array structure according to claim 1 , wherein a tubular channel region in the memory cell transistor is a polysilicon or germanium doped silicon semiconductor region.

9. A vertically foldable memory array structure, comprising:

a memory cell transistor set distributed in columns and rows and comprising a plurality of memory cell transistors, in which a gate of each memory cell transistor is connected to a word line;

a plurality of drain selection transistors and a plurality of source selection transistors, in which each of the memory cell transistor sets in a N th column is connected to one drain selection transistor, and each of the memory cell transistor sets in a (N+1) th column is connected to one source selection transistor; and

a plurality of bottom connecting lines connected between a memory cell transistor set in a M th row and in the N th column and a memory cell transistor set in a (M+1) th row and in the (N+1) th column,

wherein a drain of a drain selection transistor and a source of a source selection transistor corresponding to the memory cell transistor set in each row are connected to a same bit line, in which N and M are an integer.

10. The vertically foldable memory array structure according to claim 9 , wherein the memory cell transistor comprises:

a tubular polysilicon body filled with an insulating dielectric; and

a tubular gate structure surrounding the tubular polysilicon body.

11. The vertically foldable memory array structure according to claim 10 , wherein the tubular gate structure comprises a tubular tunneling oxide layer, a tubular silicon nitride layer, a tubular blocking oxide layer and the tubular gate layer sequentially surrounding the tubular polysilicon body.

12. The vertically foldable memory array structure according to claim 9 , wherein the memory cell transistor is a charge trapping type memory or a nano-crystal memory.

13. The vertically foldable memory array structure according to claim 9 , wherein a tubular channel region in the memory cell transistor is a polysilicon or germanium doped silicon semiconductor region.