Silica-based antibacterial and antifungal nanoformulation
View Patent ↗A silica-based nanoformulation and method is used to treat citrus canker, inhibit the growth of mold and mildew, and add nutrients to soil used for agricultural purposes. The nanotechnology-enabled copper-loaded, silica nanoformulation (CuSiNP/NG) design is a “revolutionary re-invention” of Cu for safe application because it provides a formulation with maximum abundance of ionic Cu, provides sustained and optimal Cu ion release for long-term disease protection, better adherence to plant surfaces and structural surfaces due to gel-based nanostructure of CuSiNG, thus avoiding multiple spray applications and reducing the amount of Cu used in comparison to existing Cu compounds without compromising antibacterial activity. Thus, the silica-based nanoformulation releases copper in non-toxic quantities to the environment and the silica matrix provides an environmentally safe host material with a flexible design that is optimized to provide specific antifungal and antibacterial remediation using infrequent applications.
1. A method for synthesizing a silica-based nanoformulation containing antibacterial and antifungal agents using a one-pot, acid-catalyzed, sol-gel process, comprising the steps of:
mixing an acidic reaction medium, tetraethoxysilane (TEOS), water, ethanol and an antibacterial or antifungal agent to form mixture I; wherein the antibacterial or antifungal agent is a plurality of copper (Cu) ions sourced from a copper compound;
allowing the reaction of mixture I to form a plurality of silica-based nanoparticles;
adding a neutralizing agent after the formation of a plurality of nanoparticles to adjust the pH value of the reaction mixture to approximately 7.0;
allowing the neutralized reaction of mixture I to continue to allow gelation to occur, wherein the nanogel structure consists of interconnected nanoparticles; and
collecting a porous silica-based nanogel having antibacterial and antifungal agents bound in a plurality of interconnected nanoparticles of the nanogel, wherein the plurality of interconnected nanoparticles of the nanogel contain a plurality of Cu ions electrostatically bound to the nanoparticle core, a plurality of Cu ions covalently bound to a hydrated shell surface and nanopores of the nanoparticle, and a plurality of Cu oxide/hydroxide as nanoclusters/nanoparticles bound to the surface of the nanoparticle.
2. The method of claim 1 , wherein the acidic reaction medium is an aqueous solution of an acid selected from the group consisting of hydrochloric acid, sulfuric acid and nitric acid.
3. The method of claim 1 , wherein the reaction of mixture I occurs at ambient temperatures and pressures.
4. A method for synthesizing a silica-based nanoformulation containing antibacterial and antifungal agents using a one-pot, acid-catalyzed, sol-gel process, comprising the steps of:
mixing an acidic reaction medium, tetraethoxysilane (TEOS), water, ethanol and an antibacterial or antifungal agent to form mixture I; wherein the antibacterial or antifungal agent is a plurality of copper (Cu) ions sourced from a copper compound;
allowing the reaction of mixture I to form a plurality of silica-based nanoparticles in a nanogel structure, wherein the nanogel structure at a pH of about 7 consists of interconnected nanoparticles; and
collecting a porous silica-based nanogel having antibacterial and antifungal agents bound in a plurality of interconnected nanoparticles of the nanogel, wherein the plurality of interconnected nanoparticles of the nanogel contain a plurality of Cu ions electrostatically bound to the nanoparticle core, a plurality of Cu ions covalently bound to a hydrated shell surface and nanopores of the nanoparticle, and a plurality of Cu oxide/hydroxide as nanoclusters/nanoparticles bound to the surface of the nanoparticle.
5. The method of claim 4 , wherein the acidic reaction medium is an aqueous solution of an acid selected from the group consisting of hydrochloric acid, sulfuric acid and nitric acid.
6. The method of claim 4 , wherein the reaction of mixture I occurs at ambient temperatures and pressures.