Method for the production of three-dimensional microstructures

1. A method for the production of three-dimensional microstructures, comprising the following steps:

applying a source material ( 1 ) having a property that is changeable by exposure to electromagnetic radiation ( 7 ) onto a substrate ( 2 ),

writing a three-dimensional source structure ( 4 , 8 , 12 ) into the source material ( 1 ) via a locally resolving exposure by inserting a focused laser beam ( 5 ) into the source material ( 1 ) to directly form the three-dimensional source structure,

removing the source material ( 1 ) except for the three-dimensional source structure ( 4 , 8 , 12 ),

molding a target material which the micro-structure ( 10 ) to be produced is made from using the source structure,

providing a shell structure surrounding a form of a microstructure ( 10 ) to be produced, with the source structure ( 8 , 12 ) being created as the shell structure or the shell structure being produced using the source structure ( 12 ), and

inserting the target material into the shell structure.

2. A method according to claim 1 , wherein the source structure ( 8 ) is written, which surrounds the form of the microstructure ( 10 ) to be produced as a matrix, and the source material ( 1 ) is removed except for the source structure ( 8 ) and the source structure ( 8 ) is used as a shell structure.

3. A method according to claim 1 , wherein the source structure ( 12 ) is written with a closed exterior form, which essentially matches an exterior form of the microstructure ( 10 ) to be produced such that the source material ( 1 ) is removed except for the source structure ( 12 ) and the shell structure surrounding the source structure ( 12 ) is created by way of coating with an auxiliary material ( 13 , 16 ), and subsequently the source structure ( 12 ) is removed.

4. A method according to claim 3 , wherein the source structure ( 4 , 8 , 12 ) is created directly by laser writing, rapid prototyping, or stereo-lithography.

5. A method according to claim 3 , wherein the shell structure is opened mechanically for removing the source structure ( 12 ), by way of polishing, cutting, or etching methods.

6. A method according to claim 1 , wherein insertion of the target material into the shell structure occurs by way of precipitation from a solution or via electroless plating.

7. A method according to claim 1 , wherein several different target materials are inserted into the shell structure subsequently or simultaneously.

8. A method according to claim 1 , wherein Au, Ag, Cu, Ni, W, Co, or alloys of these metals or alloys of NiFe, NiCo, SnPb are used as target materials.

9. A method according to claim 1 , wherein a resist or sinter material is used as the source material ( 1 ).

10. A method according to claim 1 , wherein a substrate ( 2 ) is used with an electrically conductive surface.

11. A method according to claim 10 , wherein prior to inserting the target material ( 10 ) into the shell structure, areas of an electrically conductive surface of the substrate ( 2 ) surrounding the shell structure are covered by an isolating layer ( 9 ).

12. A method according to claim 1 , wherein a substrate ( 2 ) is used comprising an electrically isolating material with at least one electrically conductive passage ( 11 ) into an interior ( 15 ) of the shell structure.

13. A method according to claim 1 , wherein the shell structure is removed after the insertion of the target material ( 10 ).