HEAT SINK FOR MEMORY MODULES
An embodiment is a method and apparatus to provide thermal management for a memory module with a heat sink. A top element has a first portion with a top area covering a substantial top surface of the memory module and a second portion bent at an angle that is substantially perpendicular to the first portion and having a height that is approximately equal to thickness of the memory module. A bottom element has a third portion with a bottom area covering a substantial bottom surface of a memory module and a fourth portion bent at an angle that is substantially perpendicular to the third portion and having a height that is approximately equal to the thickness of the memory module. The fourth portion is attached to the second portion.
1 . A heat sink comprising:
a top element having a first portion with a top area covering a substantial top surface of a memory module and a second portion bent at an angle that is substantially perpendicular to the first portion and having a height that is approximately equal to thickness of the memory module; and
a bottom element having a third portion with a bottom area covering a substantial bottom surface of a memory module and a fourth portion bent at an angle that is substantially perpendicular to the third portion and having a height that is approximately equal to the thickness of the memory module, the fourth portion attached to the second portion.
2 . The heat sink of claim 1 wherein the fourth portion is attached to the second portion by adhesive.
3 . The heat sink of claim 1 wherein the first portion is attached to the top surface of the memory module by adhesive.
4 . The heat sink of claim 1 wherein the third portion is attached to the bottom surface of the memory module by adhesive.
5 . The heat sink of claim 1 wherein one of the top and the bottom elements has a thickness between 0.2 mm and 1.0 mm inclusive.
6 . The heat sink of claim 1 wherein one of the top and the bottom elements is made of one of copper, aluminum, and an alloy including aluminum or copper.
7 . The heat sink of claim 1 wherein the first portion has a lip with a hole aligned with a support base secured to a printed circuit board, the hole accommodating a fastening element to secure the top element to the support base.
8 . A method comprising:
forming, from a top element, a first portion with a top area covering a substantial top surface of a memory module and a second portion bent at an angle that is substantially perpendicular to the first portion and having a height that is approximately equal to thickness of the memory module;
forming, from a bottom element, a third portion with a bottom area covering a substantial bottom surface of the memory module and a fourth portion bent at an angle that is substantially perpendicular to the third portion and having a height that is approximately equal to the thickness of the memory module; and
attaching the fourth portion to the second portion.
9 . The method of claim 8 wherein attaching comprises attaching the fourth portion to the second portion by adhesive.
10 . The method of claim 8 further comprising attaching the first portion to the top surface of the memory module by adhesive.
11 . The method of claim 8 further comprising attaching the third portion to the bottom surface of the memory module by adhesive.
12 . The method of claim 8 wherein one of the top and the bottom elements has a thickness between 0.2 mm and 1.0 mm inclusive.
13 . The method of claim 8 wherein one of the top and the bottom elements is made of one of copper, aluminum, and an alloy including aluminum or copper.
14 . The method of claim 8 further comprising drilling a hole in a lip of the first portion to align with a support base secured to a printed circuit board, the hole accommodating a fastening element to secure the top element to the support base.
15 . A board assembly comprising:
a socket connector attached to a printed circuit board;
a memory module inserted into the socket connector; and
a heat sink covering the memory module, the heat sink comprising:
a top element having a first portion with a top area covering a substantial top surface of the memory module and a second portion bent at an angle that is substantially perpendicular to the first portion and having a height that is approximately equal to thickness of the memory module, and
a bottom element having a third portion with a bottom area covering a substantial bottom surface of the memory module and a fourth portion bent at an angle that is substantially perpendicular to the third portion and having a height that is approximately equal to the thickness of the memory module, the fourth portion attached to the second portion.
16 . The board assembly of claim 15 wherein the fourth portion is attached to the second portion by adhesive.
17 . The board assembly of claim 15 wherein the first portion is attached to the top surface of the memory module by adhesive.
18 . The board assembly of claim 15 wherein the third portion is attached to the bottom surface of the memory module by adhesive.
19 . The board assembly of claim 15 wherein one of the top and the bottom elements has a thickness between 0.2 mm and 1.0 mm inclusive.
20 . The board assembly of claim 15 wherein one of the top and the bottom elements is made of one of copper, aluminum, and an alloy including aluminum or copper.
21 . The board assembly of claim 15 wherein the first portion has a lip with a hole aligned with a support base secured to a printed circuit board, the hole accommodating a fastening element to secure the top element to the support base.