IP Library Patent Application 13535316
Patent Application
App. No. 13/535,316

INSERTION TOOL FOR MEMORY MODULES

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Quick Facts
Patent No.
US None
App. No.
13/535,316
Abstract

An embodiment is a method and apparatus to provide an insertion tool for a memory module. First and second spacers are located at a predetermined distance. Each has a flat top surface and a bottom surface with a longitudinal opening having a narrow width that accommodates a first thickness of a printed circuit board (PCB). First and second guides are attached to sides of the first and second spacers, respectively, such that a guide distance between the first and second guides corresponds to a combined thickness of the first thickness and side thicknesses of a socket connector into which the PCB is inserted. Each of the first and second guides has two end portions that extend downward by a height.

Claims (18)

1 . An insertion tool comprising:

first and second spacers located at a predetermined distance, each having a flat top surface and a bottom surface with a longitudinal opening having a narrow width that accommodates a first thickness of a printed circuit board (PCB); and

first and second guides, each having two end portions that extend downward by a height and attached to sides of the first and second spacers, respectively, such that a guide distance between the first and second guides corresponds to a combined thickness of the first thickness and side thicknesses of a socket connector into which the PCB is inserted.

2 . The insertion tool of claim 1 wherein the predetermined distance is comparable with length of the PCB.

3 . The insertion tool of claim 1 wherein the flat top surface has an area that accommodates an actuator for pressing down.

4 . The insertion tool of claim 1 wherein the height of the two end portions of each of the first and second guides is approximately equal to width of the PCB.

5 . The insertion tool of claim 1 wherein the height of the two end portions of each of the first and second guides extends at least past edge of the socket connector when the PCB is inserted into the connector while being fully pressed inside the longitudinal opening of the first and second spacers.

6 . The insertion tool of claim 1 wherein the first and second spacers are located at the predetermined distance to provide a see-through top.

7 . The insertion tool of claim 1 wherein the first and second spacers and the first and second guides are integrated together.

8 . The insertion tool of claim 1 wherein the first and second spacers and the first and second guides are attached by adjustable attachment elements.

9 . The insertion tool of claim 1 wherein PCB is a memory module.

10 . A method of inserting a printed circuit board (PCB) having a PCB thickness into a connector comprising:

aligning a first edge of the PCB in slot of a socket connector having side thicknesses;

aligning a second edge of the PCB with a longitudinal opening having a narrow width accommodating the PCB thickness, the longitudinal opening being on a bottom surface of each of first and second spacers located at a predetermined distance, the first and second spacers being attached to first and second guides at sides of the first and second spacers such that a guide distance between the first and second guides corresponds to a combined thickness of the PCB thickness and the side thicknesses of the socket connector; and

pressing down on top surfaces of the first and second spacers such that the PCB is fully inserted into the slot of the socket connector.

11 . The method of claim 10 wherein each of the first and second guides has two end portions, each extending downward by a height.

12 . The method of claim 10 wherein pressing down comprises:

pressing down on top surfaces of the first and second spacers such that the height of the two end portions of each of the first and second guides extends at least past edge of the socket connector when the PCB is inserted into the connector.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Aug 8, 2015
From: VIRTIUM TECHNOLOGY INC.; VIRTIUM OPCO LLC
To: VIRTIUM LLC
Reel/Frame 036284/0124 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 27, 2012
From: HOANG, PHAN F.
To: VIRTIUM TECHNOLOGY, INC.
Reel/Frame 028456/0274 →